Wafer level packaging structure of chip, and preparation method of wafer level packaging structure

A wafer-level packaging and chip technology, applied in electrical components, circuits, semiconductor devices, etc., to overcome chip short-circuits, improve welding strength and sealing effect
CN109346533AInactive Publication Date: 2019-02-15XIAN TRANSETERNAL ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAN TRANSETERNAL ELECTRONICS
Publication Date
2019-02-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a wafer level packaging structure of a chip. The wafer level packaging structure comprises a chip, and further comprises a vacuum cavity structure, wherein the chip is packagedinside the vacuum cavity structure; the vacuum cavity structure comprises a silicon wafer supporting shell; a first antireflection film is arranged on the upper surface of the silicon wafer supportingshell; a second antireflection film is arranged at the position, opposite to the first antireflection film, of the inner surface of the silicon wafer supporting shell; a getter film is arranged beside the second antireflection film; a first solder ring is arranged on the periphery of the chip; a second solder ring and a third solder ring are arranged at the bottom of the silicon wafer supportingshell; and the first solder ring and the third solder ring are bonded and sealed in a vacuum environment to form the vacuum cavity structure.
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Description

technical field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a chip wafer-level packaging structure and a preparation method thereof. Background technique

[0002] Infrared detectors are the core components of thermal imaging systems and the key to detecting, identifying and analyzing infrared information of objects. They are widely used in various industries such as military, industry, transportation, security monitoring, meteorology, and medicine. Traditional infrared detectors are mainly packaged at the chip level, using metal or ceramic shells. The overall quality is heavy, the volume is large, and the cost is high. The packaging cost accounts for 90% of the entire detector cost, which is not conducive to the market application and promotion of the product.

[0003] Wafer-level packaging is to add a capped silicon chip directly on the wafer after the entire wafer is produced, and uniformly package a single chip throu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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