Combined sensor

Abstract

The invention discloses a combined sensor. The combined sensor comprises a base plate, wherein the base plate has an upper surface and a lower surface; a first MEMS (Micro-Electro-Mechanical System) chip and a first ASIC (Application Specific Integrated Circuit) chip which are mounted on the upper surface of the base plate, wherein the first MEMS chip and the first ASIC chip are electrically connected, and the first MEMS chip is a capacitive structure; and a second MEMS chip and a second ASIC chip which are mounted on the upper surface of the base plate, wherein the second MEMS chip and the second ASIC chip are electrically connected, and a working voltage of the second MEMS chip is an alternating voltage, the shortest distance between the first MEMS chip and the second ASIC chip is d1, the d1 is greater than or equal to 0.3mm, the shortest distance between the first ASIC chip and the second ASIC chip is d2, and the d2 is greater than or equal to 1.2mm. According to the technical scheme provided by the invention, parasitic capacitance effect is weakened, so electromagnetic induction is reduced. When the combined sensor works, background noises of the first MEMS chip are greatly reduced and integrated performance of the combined sensor is improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a combined sensor. Background technique [0002] Two MEMS chips and two ASIC chips are packaged to form a combined sensor, specifically the first MEMS chip is electrically connected to the first ASIC chip, the second MEMS chip is electrically connected to the second ASIC chip, the first MEMS chip is a capacitive structure, and the second MEMS chip is electrically connected to the second ASIC chip. The working voltage of the second MEMS chip is AC voltage. Due to the compact packaging space, when the combination sensor is working, due to the existence of parasitic capacitance effect, the noise floor of the first MEMS chip is relatively large, thus affecting the overall performance of the combination sensor. Contents of the invention [0003] The main purpose of the present invention is to propose a combined sensor, aiming at improving the performance of the combined sensor. [...

AI Technical Summary

Problems solved by technology

[0002] Two MEMS chips and two ASIC chips are packaged to form a combined sensor, specifically the first MEMS chip is electrically connected to the first ASIC chip, the second MEMS chip is electrically connected to the second ASIC chip, the first MEMS chip is a capacitive structure, and the second MEMS chip is electrically connected to the second ASIC chip. The working voltage of the second MEMS chip is AC voltage. Due to the compact packaging space, when the combination sensor is working, due to the existence of parasitic capacitance effect, the background noise of the first MEMS chip is relatively large, which affects the overall performance of the combination sensor.

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