Heat dissipation structure of large-target-surface image sensor

A technology of image sensor and heat dissipation structure, which is applied in image communication, electric solid-state devices, semiconductor devices, etc., to achieve obvious effects, large contact area, and reduce background noise

Active Publication Date: 2018-11-30
BEIJING DAHENG IMAGE VISION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the heat dissipation problem of the current large target surface image sensor, the present invention provides a heat dissipation structure of the large target surface image sensor, which improves the structure of the image sensor seat, the heat dissipation plate and the PCB board,

Method used

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  • Heat dissipation structure of large-target-surface image sensor
  • Heat dissipation structure of large-target-surface image sensor
  • Heat dissipation structure of large-target-surface image sensor

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Embodiment Construction

[0030]The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are only used to illustrate the present invention, but not to limit the scope of the present invention.

[0031] This embodiment describes a heat dissipation structure of a large target surface image sensor, the heat dissipation structure is mainly aimed at image sensors with PGA packaging (pin grid array packaging technology), such as figure 1 As shown, it includes an image sensor board 1 , a heat sink 2 , a thermally conductive silicone pad 3 and a front case cover 4 .

[0032] The image sensor board 1 includes an image sensor circuit board 10 , an image sensor mount 11 and an image sensor chip 12 . The image sensor circuit board 10 can be a PCB board, such as figure 2 As shown, its four corners are respectively provided with metallized mounting holes 101, which can be used to fas...

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Abstract

The invention relates to a heat dissipation structure of a large-target-surface image sensor. The heat dissipation structure comprises an image sensor board, a heat dissipation panel and a casing front cover; the image sensor board comprises an image sensor circuit board, an image sensor base and an image sensor chip; the image sensor base is fixed on the image sensor circuit board; the heat dissipation panel is mounted on the image sensor base, the heat dissipation panel is provided with rectangular through holes, pins of the image sensor chip are inserted into the rectangular through holes and is connected with the image sensor base; and the image sensor board presses and mounts the heat dissipation panel on the casing front cover. The heat dissipation structure provided by the inventiondissipates heat by virtue of the heat dissipation panel and also dissipates the heat by virtue of a PCB mounted on the casing front cover, structure is simple and compact, the problem of compact layout is dramatically solved, the aim of heat dissipation of the large-target-surface image sensor can be realized, and disassembly and assembly of the image sensor also can be facilitated.

Description

technical field [0001] The invention relates to a heat dissipation structure of an image sensor, in particular to a heat dissipation structure of a large target surface image sensor, and belongs to the technical field of cameras. Background technique [0002] When an image sensor with a large target area and high pixels (such as CCD or CMOS) works, it will generate more heat, and the image sensor is more sensitive to temperature. As the temperature rises, the thermal noise of the image will increase. For long-time work or high ambient temperature, if the image sensor does not have a good heat dissipation effect, it will not only affect the image quality, but even damage the chip. [0003] The existing heat dissipation structure for the camera image sensor mainly dissipates heat from three aspects: a casing, a heat dissipation plate, and a PCB (printed circuit board). [0004] 1. Heat dissipation through the casing, such as a structurally improved industrial camera casing di...

Claims

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Application Information

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IPC IPC(8): H04N5/225H04N5/369H01L27/146
CPCH01L27/14601H04N23/51H04N23/54H04N25/70
Inventor 仇开阳侯雪琴黄伟伟李永怀高原
Owner BEIJING DAHENG IMAGE VISION
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