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WAT testing method and system

A test method and test system technology, applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as re-testing or scrapping of pulling stations, data leakage, etc.

Inactive Publication Date: 2019-02-26
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In order to overcome the deficiencies in the above-mentioned prior art, the purpose of the present invention is to provide a WAT ​​testing method and system, which can efficiently process the Lot interrupt data and can accurately ensure the integrity of the Lot data, thereby avoiding the leakage of incomplete data. Unnecessary pull station retesting or scrapping occurs

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  • WAT testing method and system

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Embodiment Construction

[0037] The implementation of the present invention is described below through specific examples and in conjunction with the accompanying drawings, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0038] image 3 It is a flow chart of steps of a WAT ​​testing method of the present invention. like image 3 Shown, a kind of WAT testing method of the present invention comprises the steps:

[0039] In step S1, a batch (Lot) of wafers (Wafer) is placed on a testing machine for WAT testing. Specifically, a batch is fixed to a certain number such as 50 wafers (Wafer), and the produced ba...

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PUM

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Abstract

The invention discloses a WAT testing method and system. The method comprises the following steps: S1, placing a batch of wafers on a testing machine to carry out WAT testing; S2, starting an interruption processing process when the test is interrupted, recording the ID of tested wafers, and automatically transferring out data of the tested part for temporary storage; S3, when continuing the testafter troubleshooting, continuing the test according to the recorded ID of the tested wafers, and sending the subsequent test data into the temporary storage path; S4, at the end of the test, mergingthe test data of the parts under the temporary storage path, forming complete test data and sending the data to a normal EDA path. The method and the system not only can efficiently process the Lot interruption data but also can accurately ensure the integrity of the Lot data, thereby avoiding the occurrence of unnecessary retesting or scrapping caused by mistaken release of incomplete data.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing, in particular to a WAT ​​(Wafer Acceptance Test, Wafer Acceptance Test) testing method and device. Background technique [0002] With the advancement of technology, the requirements of the integrated circuit manufacturing process are increasing day by day, and because the integrated circuit manufacturing cycle is long and the cost is high, it is particularly important to improve the manufacturing efficiency and quality of the manufacturing process. In the manufacturing process of the product, it needs to go through hundreds of process steps. Wafer Acceptance Test (WAT) plays an important role as a chip quality inspection process. Wafer Acceptance Test includes a variety of test items , and is an indispensable step in chip fabrication [0003] Usually, in order to reduce costs, integrated circuits are generally produced in batches (Lot) according to needs, and each batch is fix...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/67
CPCH01L21/67242H01L22/14H01L22/20
Inventor 赵朝珍莫保章
Owner SHANGHAI HUALI MICROELECTRONICS CORP