A improved three -dimensional three -dimensional packaging method

Abstract

The invention discloses an improved three-dimensional packaging method. A component and lead bridges are assembled to a PCB board. One end of a number of pins is connected through resin potting to acquire a bottom plate. Laminated plates and the bottom plate are clamped on a jig. The laminated plates are vertically arranged up and down in layers. Resin is potted between two adjacent laminated plates. After resin is cured and molded, cutting is carried out according to the boundary dimension of a designed chip. The cross sections of the lead bridges of the laminated plates are exposed on the side. Metal plating, metal plating engraving and wire connection molding are carried out on the side. Second potting molding is carried out, and resin is potted at the side and top of a third molded module. Miniaturization and high integration are realized, and at the same time a metal plating is not exposed on the outer surface of a module and is protected. Even if the surface of a module is scraped, the interconnection metal plating of upper and lower layers is prevented from being damaged and falling off. The metal plating is not susceptible to moisture, contaminants and the like.

Description

technical field [0001] The invention relates to packaging technology, in particular to an improved three-dimensional packaging method. Background technique [0002] In the miniaturized three-dimensional packaging module realized by the existing process, the electrical interconnection of the upper and lower layers is realized by laser engraving the metal coating on the surface of the molding module. The metal coating is completely exposed on the module surface, and the thickness of the coating is very thin, about 20um. On the one hand, during the transportation, handling and use of the module, scratches will inevitably occur on the surface of the module, which may easily cause the surface coating of the module to be damaged and fall off, or to be damaged due to exposure, and eventually lead to failure of the molded module and chip packaging. On the other hand, since the metal plating layer interconnecting the upper and lower layers is exposed on the surface of the forming mod...

AI Technical Summary

Problems solved by technology

On the one hand, during the transportation, handling and use of the module, scratches will inevitably occur on the surface of the module, which will easily cause the surface coating of the module to be damaged and fall off, or to be damaged due to exposure, which will eventually cause the failure of the molded module and the failure of the chip package

On the other hand, since the metal plating layer interconnecting the upper and lower layers is exposed on the surface of the forming module, it is easily affected by moisture, pollutants, etc., resulting in a decrease in the insulation strength between the metal plating layers on the surface of the forming module, and eventually a short circuit failure occurs

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