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electronic device

A technology of electronic devices and heat dissipation sheets, which is applied in the direction of cooling/ventilation/heating transformation, modification through conduction and heat transfer, etc., which can solve the problems of high shell temperature and increased cost

Active Publication Date: 2020-06-02
WISTRON NEWEB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the known technology, a heat conduction pad or a heat conduction medium such as heat dissipation paste is arranged between the heat conduction component and the housing to conduct heat conduction, which will increase the cost and may also cause the temperature of the housing of the electronic device to be too high

Method used

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Embodiment Construction

[0040] Figure 1A is a top view showing the main components of the electronic device E1 according to the first embodiment of the present invention. Figure 1B is displayed Figure 1A The 1B-1B direction sectional view in. refer to Figure 1A , Figure 1B , the electronic device E1 according to the first embodiment of the present invention includes a heat source S, a heat conducting component 1 and a heat dissipation sheet 2 . The heat conducting component 1 includes a groove 13 , the groove 13 is thermally connected to the heat source S. As shown in FIG. refer to Figure 1A , Figure 1B , the heat dissipation sheet 2 is attached to the heat conducting component 1 and covers the groove 13 .

[0041] refer to Figure 1A , in this embodiment, the heat dissipation sheet 2 may be a material with thermal conductivity such as aluminum foil, copper foil, or graphite sheet. The thickness of the heat dissipation sheet 2 is between 0.1 mm and 0.5 mm. The heat conducting component 1 ...

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Abstract

The invention provides an electronic device. The electronic device comprises a heat source, a heat conducting part and a heat dissipation thin sheet. The heat conduction part comprises a groove whichis in heat connection with the heat source. The heat dissipation thin sheet is adhered to the heat conduction part and covers the groove. According to the invention, by use of the heat dissipation thin sheet, the groove is covered by quite small size and the heat resistance at the groove is reduced, so heat conduction ability and heat dissipation efficiency are improved.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device with heat dissipation requirements. Background technique [0002] Electronic devices with small size and unable to use active heat dissipation, the air hardly flows inside the electronic device, so the heat dissipation method mainly transfers heat to the casing of the electronic device through conduction and radiation, and then the casing dissipates the heat to the external environment. In small-sized electronic devices, when the distance between the heat-conducting part and the housing is small (such as 0.5mm), the radiation thermal resistance will be greater than the conduction thermal resistance (maybe more than 5 times), and conduction becomes the main heat dissipation method to reduce the conduction thermal resistance. It can effectively reduce the temperature inside the product. In the known technology, a heat conduction pad or a heat conduction medium such as h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 张宏明张懿云陈世宏罗昱凯蔡升宏
Owner WISTRON NEWEB