evaporator unit
A technology for evaporators and evaporators, applied to evaporators/condensers, compressors with multiple evaporators, indirect heat exchangers, etc., can solve problems such as refrigerant inflow, and achieve the effect of suppressing temperature distribution
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no. 1 approach
[0049] Below, use Figures 1 to 12 The first embodiment will be described. as Figure 1 As shown in the overall structure diagram, the evaporator unit 20 of the present embodiment is applied to a vapor compression refrigeration cycle device with an ejector as a refrigerant pressure reducing device, that is, an ejector refrigeration cycle 10. Further, the ejector refrigeration cycle 10 is applied to an air conditioning device for a vehicle and cools the air (supply air) blown to the interior of the vehicle as a cooling object space. Therefore, the cooling target fluid of the evaporator unit 20 of the present embodiment is air.
[0050] In addition, in the ejector refrigeration cycle 10 of the present embodiment, HFC refrigerant (specifically, R134a) is used as the refrigerant to form a subcritical refrigeration cycle in which the refrigerant pressure on the high-pressure side does not exceed the critical pressure of the refrigerant. Further, the refrigerant is mixed with refrigerant ...
no. 2 approach
[0196] In the present embodiment, for example Figure 13 As shown, compared with the first embodiment, a plurality of second discharge side communication holes 93D are arranged at intervals in the length direction of the plate member 93, and the opening area of each second discharge side communication hole 93D is changed.
[0197] More specifically, in the present embodiment, the opening area of each second discharge side communication hole 93D configured in the first area EF1 The opening area of each second discharge side communication hole 93D configured in the third area Ef3 and the opening area of each second discharge side communication hole 93D configured in the fifth area EF5 are larger than the sum of the opening area of the second discharge side communication hole 93D configured in the second area ef2 and the opening area of the second discharge side communication hole 93D configured in the fourth area ef4.
[0198] In addition, Figure 13 It is the same as that described i...
no. 3 approach
[0202] In the present embodiment, for example Figure 14 In embodiment 93D, a second connecting plate is formed on the side of the first connecting plate 93D. In addition, Figure 14 It is the same as that described in the first embodiment Figure 4 Corresponding figure.
[0203] In the present embodiment, the opening shape of the second discharge side communication hole 93D in the first region EF1 to the fifth region EF5 is changed, so that the opening area of the second discharge side communication hole 93D is larger than that of the second region ef2 and the fourth region ef4 in each of the first region EF1, the second region ef2 and the third region Ef3.
[0204] The structure and operation of other evaporator units 20 and ejector refrigeration cycle 10 are the same as those of the first embodiment. Therefore, in the ejector refrigeration cycle 10 of the present embodiment, the same effect as that of the first embodiment can also be obtained.
[0205] Further, even if the second ...
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