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Heat treatment device and heat treatment method

A technology of heat treatment device and heat treatment method, applied in heat treatment furnace, heat treatment equipment, heat treatment process control, etc., can solve problems such as poor quality, deformation, and different hardness of processed objects, so as to suppress deformation or hardness difference and suppress temperature distribution, avoiding poor quality effects

Inactive Publication Date: 2015-09-30
IHI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In this way, when a temperature distribution occurs on the object to be processed, it may become a cause of deformation.
Furthermore, when quenching is performed on the object to be treated with a temperature distribution, there is a possibility that the hardness of the object to be processed will be different
[0008] On the other hand, when there is a difference in temperature between a plurality of objects to be processed, there is a possibility that the quality of the objects to be processed may differ, resulting in poor quality.

Method used

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  • Heat treatment device and heat treatment method
  • Heat treatment device and heat treatment method
  • Heat treatment device and heat treatment method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach 〕

[0064] figure 1 It is an overall configuration diagram of the vacuum heat treatment furnace 100 according to this embodiment.

[0065] The vacuum heat treatment furnace (heat treatment apparatus) 100 is an apparatus for performing heat treatment such as quenching on the object M to be processed, and a heating chamber 110 and a cooling chamber 120 are arranged adjacent to each other. A partition 130 is provided between the heating chamber 110 and the cooling chamber 120 , and when the partition 130 is opened, the object M to be processed moves from the heating chamber 110 to the cooling chamber 120 and is cooled in the cooling chamber 120 .

[0066] On the object M to be processed, heat treatment is applied sequentially by the vacuum heat treatment furnace 100 . Furthermore, the object M to be processed is made of a metal material (including alloy) such as steel containing a predetermined amount of carbon, and is formed in a substantially rectangular parallelepiped shape.

[...

no. 2 Embodiment approach 〕

[0109] image 3 It is a front sectional view of the cooling chamber 120 in this embodiment.

[0110] In this figure, for figure 1 as well as figure 2 Components that are the same as the structural elements of the first embodiment shown are given the same reference numerals, and description thereof will be omitted.

[0111] The cooling chamber 120 in the present embodiment has a structure for cooling a plurality of processed objects M collectively. In addition, the to-be-processed object M in this embodiment is formed in the outer shape smaller than the to-be-processed object M in 1st Embodiment.

[0112] A stand 14 is placed on the rollers 12 in the transport section 10 . The bracket 14 is provided with a plurality of plates formed with flow holes for cooling liquid such as punched holes and arranged in a grid pattern. A plurality of processed objects M are placed on the respective layers of the holder 14 .

[0113] The first temperature sensor 40 a in the temperature m...

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Abstract

A heat treatment device of the present invention is a heat treatment device including a cooling chamber (120) for cooling a heated treatment object (M), further including: a mist supply portion (20) for supplying a coolant in mist form into the cooling chamber; and a gas supply portion (30) for supplying a gas into the cooling chamber to adjust a flow direction of the coolant in mist form.

Description

technical field [0001] The present invention relates to a heat treatment device and a heat treatment method, for example, relates to a heat treatment device suitable for treatments such as quenching of an object to be processed. This application claims the priority of Japanese Patent Application No. 2009-095892 for which it applied to Japan on April 10, 2009, The content is used here. Background technique [0002] When high-speed cooling is required in a heat treatment apparatus that performs a treatment such as quenching by heating and cooling a metal material to be processed, a liquid-cooling type cooling apparatus or an air-cooling type cooling apparatus has conventionally been used. The cooling device of the above-mentioned liquid cooling method is excellent in cooling efficiency, but there is a problem that fine cooling control is hardly possible and the heat-treated product is easily deformed. On the other hand, in an air-cooling type cooling device, cooling control i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F27D9/00C21D1/00C21D1/18C21D1/773
CPCF27B17/0016C21D11/005F27D2009/0086C21D1/773F27D9/00C21D1/00C21D1/667C21D9/0062F27D15/02F27B17/0033C21D1/18F27B5/04
Inventor 胜俣和彦
Owner IHI CORP