Heat treatment device and heat treatment method
A technology of heat treatment device and heat treatment method, applied in heat treatment furnace, heat treatment equipment, heat treatment process control, etc., can solve problems such as poor quality, deformation, and different hardness of processed objects, so as to suppress deformation or hardness difference and suppress temperature distribution, avoiding poor quality effects
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no. 1 Embodiment approach 〕
[0064] figure 1 It is an overall configuration diagram of the vacuum heat treatment furnace 100 according to this embodiment.
[0065] The vacuum heat treatment furnace (heat treatment apparatus) 100 is an apparatus for performing heat treatment such as quenching on the object M to be processed, and a heating chamber 110 and a cooling chamber 120 are arranged adjacent to each other. A partition 130 is provided between the heating chamber 110 and the cooling chamber 120 , and when the partition 130 is opened, the object M to be processed moves from the heating chamber 110 to the cooling chamber 120 and is cooled in the cooling chamber 120 .
[0066] On the object M to be processed, heat treatment is applied sequentially by the vacuum heat treatment furnace 100 . Furthermore, the object M to be processed is made of a metal material (including alloy) such as steel containing a predetermined amount of carbon, and is formed in a substantially rectangular parallelepiped shape.
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no. 2 Embodiment approach 〕
[0109] image 3 It is a front sectional view of the cooling chamber 120 in this embodiment.
[0110] In this figure, for figure 1 as well as figure 2 Components that are the same as the structural elements of the first embodiment shown are given the same reference numerals, and description thereof will be omitted.
[0111] The cooling chamber 120 in the present embodiment has a structure for cooling a plurality of processed objects M collectively. In addition, the to-be-processed object M in this embodiment is formed in the outer shape smaller than the to-be-processed object M in 1st Embodiment.
[0112] A stand 14 is placed on the rollers 12 in the transport section 10 . The bracket 14 is provided with a plurality of plates formed with flow holes for cooling liquid such as punched holes and arranged in a grid pattern. A plurality of processed objects M are placed on the respective layers of the holder 14 .
[0113] The first temperature sensor 40 a in the temperature m...
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