Semiconductor device assembly and method of making the same
A technology of semiconductors and assemblies, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc.
Active Publication Date: 2022-07-01
MICRON TECH INC
View PDF13 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0007] There may be additional flaws and shortcomings
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] In this disclosure, numerous specific details are discussed in order to provide a thorough and illuminating description of embodiments of the present disclosure. One skilled in the art will recognize that the present disclosure may be practiced without one or more of the specific details. Well-known structures and / or operations commonly associated with semiconductor devices may not be shown and / or may not be described in detail to avoid obscuring other aspects of the present disclosure. In general, it should be understood that various other apparatuses, systems and methods than those of the specific embodiments disclosed herein are possible within the scope of the present disclosure.
[0022] The term "semiconductor device assembly" may refer to an assembly of one or more semiconductor devices, semiconductor device packages, and / or substrates, which may include interposers, supports, and / or other suitable substrates. Semiconductor device assemblies may be fabricated in...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The present invention relates to a semiconductor device assembly and a method of manufacturing the same. A semiconductor device assembly includes a semiconductor device positioned over a substrate, with a plurality of electrical interconnects formed between the semiconductor device and the substrate. The surface of the substrate includes a plurality of discrete solder mask standoffs extending toward the semiconductor device. A thermocompression bonding process is used to melt solder to form the electrical interconnect, which lowers the semiconductor device to contact and be supported by the plurality of discrete solder mask supports. The solder mask standoffs permit greater pressure to be applied during the bonding process than using conventional solder masks. The solder mask standoffs may have various polygonal or non-polygonal shapes and may be positioned in a pattern to protect sensitive areas of the semiconductor device and / or the substrate. The solder mask standoffs may be elongated shapes that protect areas of the semiconductor device and / or substrate.
Description
technical field [0001] Embodiments described herein relate to semiconductor device assemblies having die support structures and methods of providing such semiconductor device assemblies. The present disclosure relates to discrete solder mask mounts used to support semiconductor devices, such as dies, on a substrate. Background technique [0002] Semiconductor device assemblies, including but not limited to memory chips, microprocessor chips, and imager chips, typically comprising semiconductor die mounted on a substrate, which may be enclosed in a plastic protective cover or metal heat sink . The semiconductor device assembly may include various functional features, such as memory cells, processor circuits, and imager devices, and may include bond pads that are electrically connected to the functional features of the semiconductor device assembly. A semiconductor device assembly may include semiconductor dies stacked on and electrically connected to each other by individua...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/065H01L23/488H01L21/50
CPCH01L21/50H01L23/488H01L25/0655H01L2224/73204H01L24/14H01L24/81H01L2224/81191H01L2224/81141H01L2224/92125H01L2224/81024H01L2224/13101H01L24/13H01L24/17H01L24/16H01L2224/32225H01L2224/16225H01L24/32H01L24/73H01L2924/00012H01L2924/014H01L2924/00014H01L2924/00H01L2021/60007H01L2224/81203H01L21/0337
Inventor B·P·沃兹B·L·麦克莱恩J·E·明尼克马朝辉
Owner MICRON TECH INC