Electronic equipment and flexible circuit board thereof
A technology of flexible circuit boards and substrates, which is applied in the direction of printed circuits, printed circuit components, circuit bendable/stretchable components, etc., can solve problems such as breakage and cracks, so as to alleviate circuit breakage, improve quality, and avoid The effect of line breaks
Inactive Publication Date: 2019-03-05
LEADER TECH ELECTRONICS SHENZHEN INC
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Problems solved by technology
Since the bending area is a single-layer area with only a thin layer of resin, the thermosetting screen printing ink is prone to cracks and breakage after bending, which makes the quality of the flexible circuit board a hidden danger
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[0035] In order to make the object, technical solution and advantages of the present invention more clear, the electronic device of the present invention will be further described in detail through the following embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0036] see figure 1 , figure 1 It is a schematic structural diagram of a flexible circuit board 100 according to an embodiment of the present invention. The present invention provides a flexible circuit board 100, the flexible circuit board 100 is mainly used in electronic equipment, so that the electronic equipment can realize various functions it has. The flexible circuit board 100 of the present invention can avoid circuit breakage caused by external force, increase hardness, and further improve the reliability of the flexible circuit board 100 to en...
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The invention provides a flexible circuit board. The flexible circuit board comprises a substrate, a reinforcing film and a thermosetting ink layer, wherein the substrate comprises a finger part, a bending part and a device part; the bending part is connected to the finger part and the device part; the reinforcing film covers the bending part and is located at an edge position of the bending part;and the thermosetting ink layer covers the reinforcing film and the bending part. The reinforcing film is applied to the edge position of the bending part of the substrate, and then the thermosettingink layer is printed on the reinforcing film and the bending part; the hardness of the edge portion of the bending part is improved through the reinforcing film, so that the line breakage can be alleviated when the bending part is bent opposite to the device part, thereby effectively solving the problem of breakage caused by a crack which is easily generated in a bending region under the action of external force, improving the hardness of the edge position of the bending part, avoiding the line breakage caused by a condition that the bending part is bent under the action of external force, improving the quality of the flexible circuit board and further guaranteeing the usage performance of electronic equipment. The invention further provides the electronic equipment.
Description
technical field [0001] The invention relates to the technical field of electronic products, in particular to electronic equipment and flexible circuit boards thereof. Background technique [0002] Usually, the substrate of the flexible circuit board is formed by etching the circuit through the copper foil material, and then laminating the cover film on both sides of the product. At present, in order to improve the hardness of the flexible circuit board, make the bending area soft and reduce the rebound force of the bending area, heat-setting silk screen printing ink is printed on the bending area to facilitate the bending of the flexible circuit board. Since the bending area is a single-layer area with only a thin layer of resin, the thermosetting screen printing ink is prone to cracks and breakage after bending, which makes the quality of the flexible circuit board a hidden danger. Contents of the invention [0003] Based on this, it is necessary to provide a flexible ci...
Claims
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IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0281H05K1/118
Inventor 张少松吕晓敏梅得军李晓华
Owner LEADER TECH ELECTRONICS SHENZHEN INC