Control method for dry ice cleaning of chip packaging mold
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAMEN UNIV OF TECH
- Publication Date
- 2019-03-08
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor mold cleaning, in particular to a control method for dry ice cleaning of chip packaging molds. Background technique
[0002] Common mold cleaning methods are high-pressure water gun and sandblasting cleaning, but the high-pressure water gun cleaning method with water as the cleaning medium is easy to rust the mold, and the sandblasting cleaning method with sand as the cleaning medium is easy to damage the equipment and reduce the precision of the mold. The recently developed dry ice cleaning method using dry ice as the cleaning medium uses the physical characteristics of dry ice to clean the dirt on the surface of the mold without damaging the mold. It has the characteristics of environmental protection, economy, long service life, safety and efficiency.
[0003] Patent CN105107795B discloses a method for cleaning the surface of electrical components and precision hydraulic parts with dry ice, which i...