A sensor monocrystalline silicon etching device with uniform etching

Abstract

The present invention relates to the technical field of sensors, in particular to a sensor monocrystalline silicon etching device with uniform etching. The lower end is sealed; the outer wall of the rotating column between two adjacent circular plates is evenly provided with a number of sliding holes of equal height, and the sliding holes are connected with the inner wall of the rotating column; the opposite surfaces of each adjacent two circular plates are uniformly There are a number of chute slots corresponding to the positions; the sliding hole is slidably connected with a clamping plate passing through the sliding hole, and the clamping plate is used to fix the monocrystalline silicon wafer; the clamping plate slides with the corresponding chute on the two adjacent ring plates Connection, the invention has the advantages of convenient use, improved etching efficiency, improved etching effect, and reduced labor intensity of workers.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a sensor monocrystalline silicon etching device with uniform etching. Background technique [0002] In the process of processing single-crystal silicon for sensors, it needs to be etched; in the existing etching process, it is often done by stacking multiple single-crystal silicon on the wafer frame, and passing them to the wafer frame. The reactive gas is introduced at the location, and the reactive gas generates plasma in the electric field environment to etch the single crystal silicon; the wafer holder usually needs to be rotated during the etching process to increase the contact uniformity between the single crystal silicon and the plasma However, in the current etching process, single-crystal silicon wafers are stacked on the wafer frame. During the etching process of the stacked single-crystal silicon wafers, the single-crystal silicon can only be Effective etching is per...

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Problems solved by technology

[0003] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a sensor single crystal silicon etching device with uniform etching, which is used to solve the problem that only one side of the sensor single crystal silicon can be etched. Efficient etching, poor etching effect and low etching efficiency on the other side

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