Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for improving reliably of semiconductor device encapsulated by epoxy resin composition

A technology of epoxy resin and phenolic epoxy resin, applied in the direction of coating, can solve the problems of price impact, inability to meet the requirements of semiconductor reliability, etc., and achieve the effects of improving reliability, reducing water absorption and high reliability

Pending Publication Date: 2019-03-15
江苏科化新材料科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional semiconductor packaging method can only rely on improving the reliability of epoxy resin composition to improve the reliability of semiconductor devices, but affected by the price, it cannot meet the market's requirements for semiconductor reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for improving reliably of semiconductor device encapsulated by epoxy resin composition
  • Method for improving reliably of semiconductor device encapsulated by epoxy resin composition
  • Method for improving reliably of semiconductor device encapsulated by epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Use a spray gun to evenly spray a liquid organic substance on the SOP-8 semiconductor device packaged with an epoxy resin composition; the product after spraying is left to stand at room temperature for 10 minutes, and cured at 150 ° C for 1 hour .

[0045] See Table 1 for the composition of the epoxy resin composition, and see Table 1 for the performance evaluation results of the obtained processed semiconductor sealing device SOP-8.

Embodiment 2

[0047] Use a spray gun to evenly spray a liquid organic substance on the SOP-8 semiconductor device packaged with an epoxy resin composition; the sprayed product is left to stand at room temperature for 30 minutes, and cured at 150°C for 1 hour .

[0048] See Table 1 for the composition of the epoxy resin composition, and see Table 1 for the performance evaluation results of the obtained processed semiconductor sealing device SOP-8.

Embodiment 3

[0050] Use a spray gun to evenly spray a liquid organic substance on the SOP-8 semiconductor device packaged with an epoxy resin composition; the product after spraying is left to stand at room temperature for 60 minutes, and cured at 150°C for 1 hour .

[0051] See Table 1 for the composition of the epoxy resin composition, and see Table 1 for the performance evaluation results of the obtained processed semiconductor sealing device SOP-8.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for improving the reliably of a semiconductor device encapsulated by an epoxy resin composition. Main steps are as follows: spraying a liquid organic matter on the semiconductor device encapsulated by the epoxy resin composition, standing at the normal temperature for 10-60 minutes, and curing for 1-3 hours at 150-180 DEG C. According to a semiconductor encapsulating method provided by the utility model, the common or poor-reliability epoxy resin composition is used, and a moisture-proof higher-reliability semiconductor encapsulating device is obtained after thetreatment of the liquid organic matter.

Description

technical field [0001] The invention relates to a method for improving the reliability of a semiconductor device encapsulated by an epoxy resin composition. Background technique [0002] In recent years, the semiconductor industry has developed rapidly, and electronic products are used everywhere in life, but civilian semiconductor products have poor reliability and relatively short lifespan. People have higher and higher requirements for electronic products, which put forward higher and higher requirements for the reliability of civilian semiconductors. Civilian semiconductors are basically packaged with epoxy resin compositions, which are inherently less reliable than metal and ceramic packages due to factors such as price, material usage, and formulation. [0003] The traditional semiconductor packaging method can only rely on improving the reliability of the epoxy resin composition to improve the reliability of semiconductor devices, but due to the impact of price, it c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L63/00C08L83/04C08K3/22C08K3/36C09D201/02
CPCC09D201/02C08L63/00C08L2203/206C08L83/04C08K3/2279C08K3/36
Inventor 李海亮李刚王善学卢绪奎
Owner 江苏科化新材料科技有限公司