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Anti-shock overload out-of-plane stop structure of micro-inertial silicon sensor

An inertial sensor and anti-shock technology, applied in speed/acceleration/shock measurement, instruments, gyroscope/steering sensing equipment, etc., can solve problems such as broken and broken devices, improve the ability to resist out-of-plane impact, and avoid breakage The effect of failure

Inactive Publication Date: 2019-03-15
BEIJING INST OF AEROSPACE CONTROL DEVICES
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In practical applications, in addition to in-plane impacts, out-of-plane impacts often occur. When the mass works under out-of-plane impact conditions, if the impact strength is higher than the fracture strength of the silicon material, the device is prone to breakage. , fracture and other failures

Method used

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  • Anti-shock overload out-of-plane stop structure of micro-inertial silicon sensor
  • Anti-shock overload out-of-plane stop structure of micro-inertial silicon sensor
  • Anti-shock overload out-of-plane stop structure of micro-inertial silicon sensor

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Embodiment Construction

[0024] An implementation form of the present invention will be further described below in conjunction with the accompanying drawings, taking a gyroscope as an example.

[0025] The top view of the middle silicon movable structure of the silicon micromachined gyroscope sensitive structure is as follows figure 1 As shown, the side view of the traditional gyro-sensitive structure without an out-of-plane stop structure is as follows figure 2 shown. The driving mass structure 101 of the gyroscope is supported and suspended on the upper and lower bases by the anchor area 102 , and the driving mass block 101 and the anchor area 102 are connected by a beam structure 103 . The detection mass structure 105 of the gyroscope is supported and suspended on the upper and lower bases by the anchor area 106 , and the driving mass 105 and the anchor area 106 are connected by a beam structure 107 . Drive mass 101 and proof mass 105 are connected by a beam structure 104 .

[0026] By rational...

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Abstract

The invention discloses an anti-shock overload out-of-plane stop structure of a micro-inertial silicon sensor. A plurality of bump structures are arranged on an upper substrate and a lower substrate of a sensitive structure of the sensor to form the out-of-plane stop structure; and the bump structures on the upper substrate and the lower substrate are located in maximum displacement positions corresponding to a middle mass block and beam structures during out-of-plane shock and symmetrically distributed relative to the mass block and the beam structures. Certain gaps exist between the out-of-plane stop structure and the mass block & the beam structures; normal operation of the mass block and the beam structures is not influenced; large deformation of the mass block in a Z axis under strongout-of-plane shock does not occur; and the anti-shock overload capacity is improved.

Description

technical field [0001] The invention belongs to the field of micro-mechanical electronic MEMS, and in particular relates to an out-of-plane stop structure for a silicon micro-inertial sensor against impact and overload. Background technique [0002] Silicon micro-inertial sensors are micro-sensors based on silicon materials, with sensitive structural feature sizes on the order of microns to millimeters, including gyroscopes and accelerometers. Because silicon micro-inertial sensors have the characteristics of small size, light weight, and low price, they can be widely used in military and civilian fields. Especially in the military field, it can be mainly used in many occasions such as inertial guidance and attitude control of ammunition, navigation and attitude control of aircraft, and platform stabilization. [0003] Since there are many applications with strong shock and vibration in the military field, silicon micro-inertial sensors need to have corresponding shock and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/5719G01C19/5769
CPCG01C19/5719G01C19/5769
Inventor 庄海涵杨静刘福民李新坤刘国文张乐明
Owner BEIJING INST OF AEROSPACE CONTROL DEVICES
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