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Multi-material mixing device for processing conductive silver adhesive

A technology of mixing and stirring, conductive silver glue, applied in mixers, mixers, mixer accessories and other directions with rotary stirring devices, which can solve problems such as difficulty in weighing

Inactive Publication Date: 2019-03-22
衡阳思迈科科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing conductive silver glue is processed, the amount of raw materials is often controlled by weight to ensure the accuracy of raw material addition; however, some raw materials are too light in weight, so it is difficult to control raw materials by weighing

Method used

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  • Multi-material mixing device for processing conductive silver adhesive
  • Multi-material mixing device for processing conductive silver adhesive
  • Multi-material mixing device for processing conductive silver adhesive

Examples

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] Examples, please refer to Figure 1-7 , a variety of raw material mixing and stirring devices for processing conductive silver glue, including a processing box 1, a plurality of liquid feeding boxes 11 and a plurality of solid particle feeding boxes 12 are arranged in the described processing box 1, and there are A material guide device 2, the material guide device 2 is slidingly connected to the first connecting device 3, the first connecting device 3 ...

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PUM

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Abstract

The invention provides a multi-material mixing device for processing conductive silver adhesive, comprising a treatment box; the treatment box is internally provided with a plurality of liquid feedingboxes and a plurality of solid particle feeding boxes, and material guide devices are respectively arranged under the feeding boxes and the solid particle feeding boxes; the material guide devices are connected with first connecting devices in a sliding way; the first connecting devices are fixedly connected with a first connecting plate; the two ends of the first connecting plate are fixedly connected with the treatment box, and a stirring device is arranged in the middle of the lower part of the first connecting plate; a funnel-shaped fixed barrel is arranged under the stirring device; a discharge device is arranged under the fixed barrel; the discharge device is connected with a material receiving box correspondingly; the material receiving box is positioned in the treatment box. Liquid raw materials and solid raw materials are fed in a separated way, and the material guide devices are used for limiting the raw materials, so that the adding amounts of the raw materials are enabledto be more accurate, and the multiple raw materials can be mixed at a time.

Description

technical field [0001] The invention mainly relates to the technical field of conductive silver glue processing, and mainly relates to a mixing and stirring device for various raw materials used for processing conductive silver glue. Background technique [0002] Conductive silver glue is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form The conductive path realizes the conductive connection of the adhered material. The conductive silver glue has a simple process and is easy to operate, which can improve production efficiency and avoid environmental pollution caused by heavy metal lead in tin-lead solder. [0003] When the existing conductive silver glue is processed, the amount of raw materials is often controlled by weight to ensure the accuracy of raw mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F7/18B01F15/02
CPCB01F27/90B01F35/71411B01F35/7141B01F2101/36
Inventor 赵曦殷鹏刚蒋留新
Owner 衡阳思迈科科技有限公司
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