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Ultrasonic transducer and method of making the same

A technology of ultrasonic transducers and ultrasonic systems, which is applied in the manufacture/assembly of piezoelectric/electrostrictive devices, ultrasonic/sonic/infrasonic diagnosis, and sound wave diagnosis, etc. Complicated device wiring structure and other issues

Active Publication Date: 2021-02-09
SIEMENS MEDICAL SOLUTIONS USA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Since a flexible printed circuit board (FPCB) for signal processing and a flexible circuit board for grounding are generally required in order to drive the piezoelectric layer, the wiring structure of the ultrasonic transducer is complicated and the cost of manufacturing the ultrasonic transducer increases

Method used

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  • Ultrasonic transducer and method of making the same
  • Ultrasonic transducer and method of making the same
  • Ultrasonic transducer and method of making the same

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Embodiment Construction

[0030] The embodiments of the present disclosure have been described for the purpose of describing the technical concept of the present disclosure. The scope of the present disclosure is not limited to the embodiments described below or the detailed description of these embodiments.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. All terms used in the present disclosure are selected for the purpose of more clearly describing the present disclosure and should not be construed as limiting the scope of the present disclosure.

[0032] The terms "comprising", "comprising", and "having", etc. as used herein should be understood as open-ended terms meaning the possibility of including other embodiments, unless otherwise mentioned in the phrase or sentence including such terms .

[0033] Unless otherwise mentioned, singular ...

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PUM

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Abstract

Ultrasonic transducers and methods of making the same are disclosed. Ultrasound transducers for use in ultrasound systems and methods of making the same are disclosed. The ultrasonic transducer is manufactured by: forming a spacer block including a plurality of surfaces; forming a piezoelectric layer including a first portion formed on the spacer block to be in contact therewith and a second portion extending from the first portion; A connector for a plurality of pins electrically connected to at least one of the transmitting unit or the receiving unit of the ultrasound system is attached to at least one of the plurality of surfaces of the spacer block to electrically connect the plurality of pins to the first two parts; cutting the first part and the second part of the piezoelectric layer into a plurality of piezoelectric elements, wherein each of the plurality of piezoelectric elements is connected to a corresponding one of the plurality of pins of the connector; As well as forming a ground plane connected to the piezoelectric layer.

Description

technical field [0001] The present disclosure relates to ultrasound transducers for use in ultrasound systems and methods of manufacturing the same. Background technique [0002] Ultrasound systems have been widely used in the medical field due to their non-invasive and non-destructive properties for obtaining information about an object of interest inside a target object. Such an ultrasound system can provide high-resolution images of a target object in real time using high-frequency sound waves without the need for a surgical procedure in which an incision is made directly in the target object. [0003] The ultrasound system includes an ultrasound transducer for generating ultrasound signals and transmitting and receiving the generated ultrasound signals. The ultrasonic transducer includes a piezoelectric layer formed of a piezoelectric ceramic element such as lead zirconate titanate (PZT) to generate an ultrasonic signal in response to an electric pulse signal and transm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B06B1/06H10N30/87H10N30/00H10N30/06H10N30/088H10N30/80
CPCB06B1/06B06B1/0215B06B1/0622A61B8/4444B06B2201/76A61B8/4494H10N30/875H10N30/06H10N30/088H10N30/802H10N30/101
Inventor 李暻鎬金永信李柏雨
Owner SIEMENS MEDICAL SOLUTIONS USA INC