Supercharge Your Innovation With Domain-Expert AI Agents!

Electric soldering iron

An electric soldering iron and soldering iron tip technology, applied in soldering irons, auxiliary devices, metal processing equipment, etc., can solve the problems of easy force displacement, heating, product scrapping, etc., to improve the quality of pressing and avoid pressure displacement. Effect

Inactive Publication Date: 2019-03-26
鹤山市泰利诺电子有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of today's electronic technology, the precision requirements for electronics are getting higher and higher, and the number of layers of circuit boards is also increasing. In actual production, multi-layer boards need to be pressed together to achieve the fine requirements of electronic products. The method of realization is: manually place the covering film or reinforcing board on the soft board and align the position. Generally, the covering film or reinforcing board has its own glue. When the glue is melted at high temperature, the adhesion will be increased. However, it is not heated during pressing. When the area of ​​the covering film or reinforcing plate is small, it is easy to be displaced by force during pressing, resulting in product scrapping. Pressing and curing of laminates

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electric soldering iron

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0013] refer to figure 1 , an electric soldering iron, including a handle 1, a heat transfer rod 2 and a soldering iron tip 3, the head of the soldering iron tip 3 is provided with a flat plate 4, and the width of the flat plate 4 is larger than the diameter of the heat transfer rod 2. The angle between the flat plate 4 and the heat transfer rod 2 of the present invention is set at 90 to 160 degrees, preferably, the angle between the flat plate 4 and the heat transfer rod 2 is set at 135 degrees. When the operator uses it, the l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electric soldering iron. The electric soldering iron comprises a handle, a heat transfer rod and a soldering iron head, a leveling plate is connected to the head of the soldering iron head, the width of the leveling plate is larger than the diameter of the heat transfer rod, and an angle between the leveling plate and the heat transfer rod is arranged to 90-160 degrees.Heat transferring is carried out on the leveling plate through the electric soldering iron, an operator conveniently heats a cover film or a reinforced plate to melt coating glue on the surface of thecover film or the reinforced plate so as to enable the cover film or the reinforced plate to attach to a circuit board before press fitting, and the press fitting quality is improved.

Description

technical field [0001] The invention relates to the field of heating, in particular to an electric soldering iron. Background technique [0002] With the rapid development of today's electronic technology, the precision requirements for electronics are getting higher and higher, and the number of layers of circuit boards is also increasing. In actual production, multi-layer boards need to be pressed together to achieve the fine requirements of electronic products. The method of realization is: manually place the cover film or reinforcement board on the soft board and align the position. Generally, the cover film or reinforcement board comes with glue. When the glue is melted at high temperature, the adhesion will be increased. However, it is not heated during pressing. When the area of ​​the cover film or reinforcing plate is small, it is easy to be displaced by force during pressing, resulting in product scrapping. Press-fit curing of laminates. Therefore, it is necessary...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K3/03B23K3/08
CPCB23K3/03B23K3/0338B23K3/08
Inventor 詹贵全
Owner 鹤山市泰利诺电子有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com