High-temperature-resistant non-silicon release film

Abstract

A high-temperature-resistant non-silicon release film includes a release substrate layer, one surface of the release substrate layer is coated with an adhesive coating, the other side of the release substrate layer is provided with a polyphenylene sulfide high-temperature resistant layer, the outer side of the polyphenylene sulfide high-temperature resistant layer is bonded with an antistatic layer, a polyethylene waterproof layer and a buffer layer are arranged between the polyphenylene sulfide high-temperature resistant layer and the release substrate layer, the polyethylene waterproof layeris positioned between the polyphenylene sulfide high-temperature resistant layer and the buffer layer, and the buffer layer is bonded on the side of the release substrate layer away from the adhesivecoating. The advantages of that invention are simple structure, good use performance and good heat insulation and flame retardancy, the film enhances the high-temperature resistance of the product, improves the service life of the product even when the release film is used in a high-temperature environment, has a good antistatic effect, can effectively reduce static electricity generated in the use process of the product, prevents accidents caused by static electricity fire, and enhances the safety of the product in use.

Description

technical field [0001] The invention relates to the technical field of release films, in particular to a high-temperature-resistant non-silicon release film. Background technique [0002] The release film refers to the film whose surface can be distinguished. The release film is not sticky or slightly sticky after contacting with specific materials under limited conditions. It is widely used in the processing of various products, such as electronic power , IT display. Mobile phones, LCD / PDA, medical, home appliance manufacturing, anti-counterfeiting materials, semiconductors, automobiles, nameplates, ceramic sheet manufacturing, adhesive tape production and die-cutting industries. However, the existing release film has poor high temperature resistance, is easy to age in a high temperature environment, has a short service life, and has poor anti-pressure and anti-static effects. It is easy to generate static electricity during use and cause a fire. Contents of the inventio...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a high-temperature-resistant non-silicon release film to solve the problem of the release film in the prior art, which has poor high-temperature resistance, is easy to age in a high-temperature environment, has a short service life, and has anti-pressure and anti-static effects. Poor, it is easy to generate static electricity and cause fire and other problems during use

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