Optical detection method and detection device for backdrilling depth
An optical detection and depth technology, applied in the direction of the use of optical devices, measuring devices, instruments, etc., can solve the problems of destroying the work board, product waste, distortion of test results, etc., to facilitate positioning detection, improve detection efficiency, and reduce auxiliary materials. effect used
Active Publication Date: 2020-09-25
ANHUI SUN CREATE ELECTRONICS
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Problems solved by technology
[0002] The traditional metallographic section method is used to detect the depth of back drilling. This method must destroy the working board. If the internal product is used for detection, it will cause waste of products; if the external test hole is used for detection, it may cause The detection result is distorted
At the same time, this method must be ground on a special grinding device when slicing, resulting in waste of materials such as sandpaper, water, resin powder, and quartz powder, and each slice can only detect local back drilling.
[0003] Therefore, the traditional detection of back-drilling depth using metallographic slices is time-consuming and labor-intensive and cannot be detected globally.
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[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] Depend on image 3 As shown, an optical detection device for backdrilling depth includes: a detection instrument 1, a working plate 2, and a light-absorbing component 3;
[0031] Wherein, the detection instrument 1 is a pulse transceiver integrating transmitting and receiving, and is used for receiving and transmitting beam pulses;
[0032] The detection instrument 1 is provided with a positioning part at the beam pulse emission port, and the positioni...
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The invention relates to the field of detecting back drilling depth of a PCB, in particular to an optical detecting method and device for a back drilling depth. The method comprises the steps of: vertically transmitting a plurality of light beam pulses to a back drilling surface of a workbench at the same moment by a detection instrument, and setting the starting emitting time of the light beam pulses as 0s; receiving the reflected light beam pulses of each light beam pulse by the detection instrument, and recording the receiving time of each reflected light beam pulse, wherein the maximum value of the receiving time is Tmax, and the minimum value of the receiving time is Tmin; and calculating the depth H of the back drilling hole according to the maximum value Tmax and the minimum Tmin inthe receiving time of each reflected light beam pulse, the transmission speed V of the light beam pulses and the angle [theta] of a drilling needle of the back drilling hole. The optical detecting method effectively improves the detection efficiency and rapidly detects the global back drilling situation on the premise without damaging of the workbench; and moreover, the usage of secondary materials is reduced and the purpose of energy-saving and cost-reducing is achieved.
Description
technical field [0001] The invention relates to the detection field of the back-drilling depth of a PCB, in particular to an optical detection method and a detection device for the back-drilling depth. Background technique [0002] The traditional metallographic section method is used to detect the depth of back drilling. This method must destroy the working board. If the internal product is used for detection, it will cause waste of products; if the external test hole is used for detection, it may cause The detection result is distorted. At the same time, this method must be ground on a special grinding device when slicing, resulting in waste of materials such as sandpaper, water, resin powder, and quartz powder, and each slice can only detect local back drilling. [0003] Therefore, the traditional detection of back-drilling depth using metallographic slices has the problems of time-consuming and labor-intensive and cannot be detected globally. Contents of the invention...
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IPC IPC(8): G01B11/22
CPCG01B11/22
Inventor 牛顺义沈岳峰朱忠翰管美章崔良端陈彦青戴银海彭腾范晓春邓建李燚
Owner ANHUI SUN CREATE ELECTRONICS