Method for quantitatively detecting three-dimensional defects in device
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHONGQING UNIV
- Publication Date
- 2019-03-29
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of non-destructive testing of materials, and in particular relates to a method for quantitatively testing three-dimensional defects inside equipment. Background technique
[0002] Many industrial equipment have been operating under harsh conditions such as high temperature, high pressure and high-intensity alternating load for a long time. The internal defects formed or existing in the equipment during operation may cause major equipment failures or safety accidents. Therefore, internal defect identification is very important for equipment Health monitoring and accident prevention are important.
[0003] Modern non-destructive testing and evaluation technology not only needs to qualitatively detect the existence of defects, but more importantly, it needs to give quantitative detection results of related defects (size, position, shape, etc.). X-ray, ultrasonic testing, etc. Infrared thermal image non-destru...