Method for quantitatively detecting three-dimensional defects in device

A quantitative detection and defect technology, applied in the direction of material defect testing, etc., can solve the problems that affect the accuracy of quantitative verification and the low level of quantitative detection, and achieve the effect of improving anti-interference ability and high detection accuracy

Active Publication Date: 2019-03-29
CHONGQING UNIV
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Problems solved by technology

[0004] However, the low level of quantitative detection is the main problem of infrared thermal imaging non-destructive testing technology. In practical applications, infrared thermal imaging technology is usually used to qualitatively detect internal defects of the object under test. After defects are found, other detection methods are often required. Quantitative verification
However, methods such as ray and ultrasonic testing are limited by their principles, and there are also shortcomings. In the testing of composite materials, the accuracy of quantitative verification is easily affected by the influence of different material layers.

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  • Method for quantitatively detecting three-dimensional defects in device
  • Method for quantitatively detecting three-dimensional defects in device
  • Method for quantitatively detecting three-dimensional defects in device

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Embodiment Construction

[0024] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0025] join Figure 1-5 , a method for quantitatively detecting three-dimensional defects inside a device in a specific embodiment, the length, width and height of the selected shape are respectively L x , L y , L z As the tested object, the test piece of the embodiment has a three-dimensional defect inside, and the detection includes the following steps:

[0026] 1) Select K temperature sampling points on the measurement surface of the test piece, and set the guess value P of the defect geometric parameter vector P i , where i is the number of iterations;

[0027] 2) According to the guessed value P of the defect geometric parameter vector P i , establish the heat transfer model of the test piece with internal defects; according to the heat transfer model, use the finite element method (FEM) to calculate the calcul...

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Abstract

The invention relates to a method for quantitatively detecting three-dimensional defects in a device. The method comprises the following steps of: 1) selecting K temperature sampling points on the measurement surface of a measured object, setting a defect geometric parameter vector P; 2) establishing a heat transfer model of the measured object according to the guess value of P, and employing thefinite element method to calculate and obtain a temperature departure ek of the K temperature sampling points, if the ek meets an iteration stop condition, finishing the iteration process, and takingthe guess value as a detection result of P, or else, entering the step 3); 3) establishing a fuzzy inference unit corresponding to the K temperature sampling points; 4) establishing a weighting comprehensive matrix of the fuzzy inference unit, and constructing a decentralized fuzzy inference module; and 5) performing decentralized fuzzy inference, and performing iteration correction of the guess value of the P according to the decentralized fuzzy inference result to replace the correction value as a guess value, and turning to the step 2). The method provided by the invention can quantitatively detecting the three-dimensional physical dimensions and depth information of the internal defects of the device to achieve the quantitative detection.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing of materials, and in particular relates to a method for quantitatively testing three-dimensional defects inside equipment. Background technique [0002] Many industrial equipment have been operating under harsh conditions such as high temperature, high pressure and high-intensity alternating load for a long time. The internal defects formed or existing in the equipment during operation may cause major equipment failures or safety accidents. Therefore, internal defect identification is very important for equipment Health monitoring and accident prevention are important. [0003] Modern non-destructive testing and evaluation technology not only needs to qualitatively detect the existence of defects, but more importantly, it needs to give quantitative detection results of related defects (size, position, shape, etc.). X-ray, ultrasonic testing, etc. Infrared thermal image non-destru...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/72
CPCG01N25/72
Inventor 陈红王广军孙双成王堃
Owner CHONGQING UNIV
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