The invention relates to the technical field of
solder ball array optimization, in particular to a low-warpage
solder ball array optimization method and
system in FC-BGA packaging of a glass substrate, and the method comprises the steps: determining the glass substrate and a plurality of solder balls, designing a preliminary array
layout, creating a three-dimensional geometric model, carrying out the thermal loading
simulation of the three-dimensional geometric model, and obtaining a plurality of thermal
stress distribution nephograms; and executing the following operations on each thermal
stress distribution cloud picture in the plurality of thermal
stress distribution cloud pictures: obtaining a maximum thermal stress region from the thermal stress distribution cloud picture, obtaining a region position and a maximum thermal stress value according to the maximum thermal stress region, obtaining an optimal array
layout, summarizing the optimal array
layout, and obtaining the thermal stress distribution cloud picture. A plurality of thermal stress distribution cloud pictures are obtained, a plurality of optimal array layouts corresponding to the thermal stress distribution cloud pictures are obtained, the optimal array layout is obtained, the voidage of the
welding spots is calculated based on the optimal array layout, and optimization of the low-warpage
welding ball array in FC-BGA packaging of the glass substrate is completed based on the voidage of the
welding spots. According to the invention, the optimization precision and efficiency of the
solder ball layout can be improved.