The invention relates to the field of
electroforming, in particular to a measurement method of the
internal stress of an electrical deposition layer. The measurement method comprises the following procedures: dipping a
cathode test slice and an
anode test slice in a transparent
electroplating bath, annealing the
anode test slice for 30 to 50 min under the temperature of 600 to 800 DEG C before test to eliminate the
residual stress of the
anode test slice, rolling out the anode test slice under static press, making the single surface of the anode test slice insulated, measuring the
elastic modulus value E and the thickness value t of the anode test slice, and calculating the length L of the anode test slice dipped in
electroplating liquid; making the insulated surface of the anode test slice back to the
cathode test slice, connecting the
cathode test slice and the anode test slice with a power supply, providing a camera outside the transparent
electroplating bath, and calculating the displacement Z' of the bottom end of the anode test slice; measuring the thickness of the electroplated anode test slice, calculating the thickness value of the electrical deposition layer, and finally, calculating the
internal stress S of the electrical deposition layer according to a formula, i.e. S=(1 / 6)*(Et<2>Z' / dL<2>). In the invention,
computer imaging and measurement technique are adopted to accurately measure the displacement of the bottom end of the anode test slice so as to qualitatively and quantificationally measure the
internal stress of the electrical deposition layer.