SMT chip mounting method and system

A technology of placement and placement machine, which is applied in the direction of electrical components, printed circuit manufacturing, electrical components, etc., can solve the problems of low work efficiency, error-prone, unsatisfactory work efficiency, etc., and achieves high efficiency and high placement accuracy. Effect

Active Publication Date: 2019-03-29
深圳捷创电子科技有限公司
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Problems solved by technology

In the production process of circuit boards, a large number of electronic components need to be pasted on the composite substrate. At first, various electronic components were pasted manually, which was extremely inefficient and error-prone; later developed to use machines to paste, but also Only a single electronic component can be pasted, but batch paste cannot be realized, and the work efficiency is still not ideal
[0003] With the widespread use of high-speed placement machines, in the field of SMT manufacturing technology, the flexibility and compatibility of the SMT production line and its production process have also been challenged. In the prior art, in the SMT placement process, the placement of components Install it on the feeder plate (that is, the device used to temporarily store the patch components), then install the flyer plate on the SMT placement machine, then set the position of the placement component on the placement machi

Method used

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  • SMT chip mounting method and system

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[0026] The following is a detailed description of the specific implementation of the present invention. It is necessary to point out that the following implementation is only used for further description of the present invention and cannot be understood as a limitation of the protection scope of the present invention. Some non-essential improvements and adjustments made still belong to the protection scope of the present invention.

[0027] The present invention provides a SMT patch method, the specific process is as attached figure 1 Shown.

[0028] First of all, place an order according to the customer's requirements. The customer can send the raw materials or the processing plant will purchase the raw materials on their behalf. After the raw materials are purchased, they will be put into the warehouse, and then the materials will be counted and inspected according to the process requirements, and the materials will be prepared according to the actual requirements. After complet...

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Abstract

The invention provides an SMT chip mounting method and system. The SMT chip mounting method includes the steps: preparing raw materials as required, according to the process requirement, counting materials and verifying materials, and preparing materials as required successively; setting the attribute and the position of chip mounting elements as required, mounting the chip mounting elements on feeder discs to form a plurality of feeder discs with chip mounting; and setting the feeder discs on a chip mounting machine, verifying a circuit board requiring for chip mounting, and when the test conditions are satisfied, mounting the corresponding chip mounting element on the circuit board. Therefore, the SMT chip mounting method and system can improve the efficiency and is high in the chip mounting accuracy.

Description

technical field [0001] The invention relates to the manufacturing technology of printed circuit boards, in particular to an SMT patching method and system. Background technique [0002] SMT is a surface composition technology, which is a circuit connection that mounts non-lead or short-lead surface mount components on the surface of a printed circuit board PCB or the surface of other substrates, and then solders and assembles them by flow soldering or dip soldering. technology. SMD production and manufacturing execution control system is an important process system in the electronic industry, which can complete the automatic welding of precise SMD electronic components. Its core equipment is various brands of SMT machines, which cooperate with printing machines and various inspections The equipment constitutes a complete production control system. In the production process of circuit boards, a large number of electronic components need to be pasted on the composite substra...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K13/04
CPCH05K3/3494H05K13/0465
Inventor 姚慧平黄小双
Owner 深圳捷创电子科技有限公司
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