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sram test structure

A technology for testing structures and electrodes, applied in static memory, instruments, etc., can solve problems such as the inability to obtain isolation/short circuit between metal wires and metal wires, metal wires and contact holes, and inability to monitor or clarify back-channel leakage, etc.

Active Publication Date: 2021-01-29
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, as the area of ​​static random access memory (SRAM) continues to shrink, the spacing between metal lines and between metal lines and between metal lines and shared contact holes in SRAM (such as figure 2 (shown in the dotted circle) is also shrinking, and the gap between the metal wire and the metal wire and the contact hole will become the source of SRAM leakage. Isolation / short-circuit conditions between wires and metal lines and between metal lines and contact holes

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Embodiment Construction

[0027] The present invention will be described in more detail below with reference to schematic diagrams and examples. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0028] In the following description, it will be understood that when a layer (or film), region, pattern or structure is referred to as being "on" a substrate, layer (or film), region and / or pattern, it can be directly on another layer or substrate, and / or intervening layers may also be present. Further, it will be understood that when a layer is referred to as being 'under' another layer, it can be directly under, and / or one or more intervening layers may also be present. In addition, designations regarding 'on' and 'under' each layer ma...

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Abstract

The invention relates to an SRAM test structure. The device is used for testing the electric leakage condition of an SRAM memory cell. The device comprises a plurality of standard test units. Each standard test unit comprises a plurality of transistors, multiple metal wires, a first shared contact hole and a second shared contact hole. The drain electrode of the first transmission transistor is insulated from the corresponding metal wire; the drain electrode of the second transmission transistor is insulated from the corresponding metal wire; the metal wire corresponding to the drain electrodeof the first transmission transistor and the metal wire corresponding to the drain electrode of the second transmission transistor are in short circuit and are connected to a first test electrode; the metal wire covered on the first shared contact hole and the metal wire covered on the second shared contact hole are in short circuit and are connected to a second test electrode; the electric leakage condition of the SRAM memory cell is monitored by testing the current between the first test electrode and the second test electrode, so that the isolation between metals on the same layer of the SRAM and the isolation between the metals and the shared contact holes and the like are monitored.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an SRAM test structure. Background technique [0002] A static random-access memory (Static Random-Access Memory, SRAM) is a type of random-access memory. Static random access memory refers to a memory that stores data that can be kept as long as it is powered on. Static random access memory does not need to refresh the circuit, and it is fast, and is often used as a memory for various integrated circuits. [0003] figure 1 It is a schematic diagram of a 6T SRAM storage unit, which is composed of four NMOS transistors T1, T2, Q5, Q6 and two PMOS transistors Q3, Q4. The input terminals of Q5 and Q3 are connected together with the output terminals of Q6 and Q4, and the input terminals of Q6 and Q4 are connected together with the output terminals of Q5 and Q3 to form a latch. Wherein, T1 and T2 are two transmission tubes. [0004] With the continuous development of semiconductor t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C29/04
CPCG11C29/04G11C2029/0409
Inventor 崔丛丛高原
Owner SHANGHAI HUALI MICROELECTRONICS CORP