Preparation method of circuit board assembly, circuit board assembly and mobile terminal

Abstract

The invention discloses a fabrication method of a circuit board module, the circuit board module and a mobile terminal. The fabrication method of the circuit board module comprises the following stepsof providing a circuit board; packaging a first functional module on the circuit board, and forming a similarity shielding layer outside the first functional module; reserving an installation regionon the circuit board, and arranging a second functional module in the installation region; and surface-mounting a shielding cover covering the second functional module in the installation region. Thefabrication method simultaneously employs a similarity shielding technology and a shielding cover shielding technology, the two technologies are relatively low in cost, the fabrication method is simpler and reliable to implement, thus, the production cost of the mobile terminal can be reduced, meanwhile, the production efficiency of the mobile terminal is improved, the structure reliability of theshielding structure is ensured, and the shielding effect is ensured.

Description

technical field [0001] The invention relates to the technical field of communication equipment, in particular to a method for preparing a circuit board assembly, a circuit board assembly and a mobile terminal. Background technique [0002] Currently, mobile terminals generally include functional modules such as wireless local area network (WLAN), Bluetooth (BT, Bluetooth), and global positioning system (GPS). In the industry, a system-in-package (SiP, System in package) method is often adopted to integrate different functional modules in a mobile terminal. Typically, the above-mentioned WLAN, BT, and GPS are made into a single module. However, these functional modules in the module need to use the antenna of the mobile terminal to communicate. When the functional modules in the same module work at the same time, mutual electromagnetic interference is likely to occur. [0003] In order to avoid the influence of electromagnetic interference on the functional modules, conduct...

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Problems solved by technology

[0004] When using the former method, there are the following defects: it is necessary to design the spatial layout of the conductive wires, such as the angle, spacing, number, etc. of the arcs, to ensure the shielding performance, so this method will increase the production cost of the mobile terminal; dense conductive wires The spatial structure increases the risk of arc bending and collapse in the injection molding process. If the arc bends or collapses, the shielding effect cannot be guaranteed

[0005] When the latter method is used, there are the following defects: the shielding groove of the plastic sealing layer needs to be made by laser cutting. In fact, laser cutting needs to consume more time, resulting in low production efficiency of the mobile terminal; The material cost is high, which will also increase the production cost of the mobile terminal

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