Semiconductor sensor and method for manufacturing same

A manufacturing method and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem of excessive film waste
CN109562545AActive Publication Date: 2019-04-02DENSO CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
DENSO CORP
Publication Date
2019-04-02

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Abstract

Disclosed is a semiconductor sensor manufacturing method wherein an upper molding die (220) has a pair of protruding sections (224) so as to sandwich a semiconductor chip (120), the protruding sections being at positions closest to the second space (240) side in wall surface (225) portions facing side surfaces (122) of the semiconductor chip (120). Since gaps (231) between side surfaces (122) of the semiconductor chip (120) and the upper molding die (220) are narrowed by means of the pair of protruding sections (224), a flow of a resin material (143) from a first space (230) to a second space(240) can be slowed. Consequently, the first space (230) is filled with the resin material (143) before the second space (240), and the whole film (300) portion corresponding to the first space (230)is adhered to the upper molding die (220), then, the second space (240) is filled with the resin material (143).
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Description

[0001] Cross-reference of related applications

[0002] This application is based on Japanese Patent Application No. 2016-158534 filed on August 12, 2016, the contents of which are cited here. technical field

[0003] The present invention relates to a semiconductor sensor and a manufacturing method thereof. Background technique

[0004] For example, Patent Document 1 proposes a structure in which a semiconductor chip is covered with a cast resin portion so that a part of the semiconductor chip is exposed. This structure can be manufactured as follows. First, a semiconductor chip is prepared. In addition, a mold in which a space portion is formed by an upper mold and a lower mold is prepared. The upper mold has a protruding portion protruding from a portion of the upper mold corresponding to the periphery of the exposed portion of the semiconductor chip.

[0005] Next, the film was affixed to the entire surface of the upper mold facing the lower mold. In addition, a sem...

Claims

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