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Underlying recessed component placement

A component, in-groove technology, applied in the field of ball grid array, can solve the problems of unwillingness to take responsibility and test methods

Inactive Publication Date: 2019-04-02
ALCATEL LUCENT SAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty that accompanies this approach is that the BGA fabricator may be less willing to take on the responsibility and testing that goes with placing components on the BGA than simply providing the BGA itself

Method used

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  • Underlying recessed component placement
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Examples

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Embodiment Construction

[0033] The embodiments and drawings merely illustrate the principle of the present invention. Therefore, it should be understood that those skilled in the art will be able to design various arrangements, which although not explicitly described or shown herein, implement the principles of the present invention and are included in its scope. In addition, all the examples set forth herein are principally intended to be used for teaching purposes only to help readers understand the principles of the present invention and concepts provided by the inventor for further fields, and should be interpreted not to be limited to these specific set examples and conditions. Additionally, the term "or" as used herein refers to non-exclusive (ie, and / or), or unless otherwise indicated (eg, "or else" or "in the alternative"). In addition, the various embodiments described herein are not necessarily mutually exclusive, for example, some embodiments may be combined with one or more other embodimen...

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Abstract

An underlying recess is provided for component placement beneath Ball Grid Arrays allowing closer proximity for decoupling capacitors and other components. The underlying recess placement of components assists in minimizing reliability issues concerning surface mount components and provides closer proximity placement of components. The underlying recess placement of components is particularly useful for overcoming the problem of parasitic inductance of more distant component placements known in the art.

Description

Technical field [0001] The present invention relates to ball grid arrays, and specifically to the placement of components in close proximity, including decoupled components. Background technique [0002] As the density of electronic integrated circuit (EIC) packages such as ball grid array (BGA) packages, interface connection density, and clock speed increase, the requirements for electrolytically coupled BGA devices have become more stringent. It is advantageous to place these decoupling capacitors as close as possible to the BGA pad. The typical placement of surface-mount decoupling capacitors is close to the BGA device on the same side of the electronic circuit board, or on the opposite side of the electronic circuit board, connected by through holes through the circuit board. These two techniques introduce parasitic inductance due to the length of the wiring leads and the length of the conductive path through the via itself. [0003] One way to provide component placement tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/11H05K3/00H05K3/46
CPCH05K1/116H05K3/0035H05K3/0044H05K2201/09645H05K2201/10484H05K2201/10515H05K1/183H05K3/4697H05K2201/10734H05K2203/0228H05K1/0298H05K1/111H05K3/0005H05K3/0026H05K3/341H05K3/3494H05K2201/09036H05K2201/10015G06F30/392G06F30/394G06F2115/12
Inventor A·陈P·J·布朗
Owner ALCATEL LUCENT SAS