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Electronic device with liquid cooling function and liquid cooling module and radiator thereof

A water-cooled heat dissipation and water-cooled technology, applied in cooling/ventilation/heating transformation, circuits, electrical components, etc., can solve the problems of limited internal space of the host, difficult design of heat dissipation modules, etc., to achieve better heat dissipation effect and reduce space.

Active Publication Date: 2019-04-05
AURAS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the limited internal space of general hosts, it can only be used in the environment space provided, and the inflow and outflow structure of the water-cooled heat dissipation pipeline has a certain thickness or volume, which makes the design of this type of heat dissipation module relatively not easy

Method used

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  • Electronic device with liquid cooling function and liquid cooling module and radiator thereof
  • Electronic device with liquid cooling function and liquid cooling module and radiator thereof
  • Electronic device with liquid cooling function and liquid cooling module and radiator thereof

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Embodiment Construction

[0034] The following examples are provided to describe the present invention in detail, and the examples are only used as examples for illustration and will not limit the scope of protection of the present invention. In addition, the drawings in the embodiments omit elements that are not necessary or can be completed by common techniques, so as to clearly show the technical characteristics of the present invention.

[0035] The implementation description of the water-cooled heat dissipation module and the water-cooled radiator proposed by the present invention will now be described with a first embodiment. See also Figure 1A to Figure 2B . in Figure 1AIt is a three-dimensional schematic diagram of a water-cooled heat dissipation module 100 of the present invention; Figure 1B for Figure 1A A schematic diagram of the water cooling module 100 in another angle; Figure 2A for Figure 1A An exploded schematic diagram of components of the water-cooling heat dissipation module...

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Abstract

The present invention relates to an electronic device with liquid cooling function and a liquid cooling module and a radiator thereof. The radiator has a first tank, a second tank, a third tank, a first heat dissipation flow path group and a second heat dissipation flow path group. The first tank is located between the second tank and the third tank, the first heat dissipation flow path group is formed between the first tank and the second tank, and the second heat dissipation flow path group is formed between the first tank and the third tank. The radiator has a radiator inlet and a radiatoroutlet. An accommodating space is formed at a corner of the radiator, and the accommodating space corresponds to the radiator outlet. The orientation of the radiator outlet and the orientation of theradiator inlet form an angle on a projection plane.

Description

technical field [0001] The present invention relates to an electronic device with water-cooling and heat-dissipating function, its water-cooling and heat-dissipating module, and a water-cooling radiator, especially relates to an electronic device that can reduce its occupied space while maintaining a good heat-dissipating effect when applied to a computer system. The device and its water-cooled heat dissipation module and water-cooled row. Background technique [0002] With the advancement and popularization of science and technology, various electronic devices or computer equipment have already become indispensable in people's daily life, such as notebook computers, desktop computers, network servers and so on. Generally speaking, the temperature of the electronic components inside these products will increase during operation, and high temperature will easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201H01L23/467H01L23/473G06F1/203Y02D10/00H05K7/20263H05K7/2039H05K7/20272
Inventor 范牧树张哲嘉张昱霆
Owner AURAS TECH