A microcomputer cooling rack device

Abstract

The invention discloses a microcomputer heat dissipation frame device, and belongs to the technical field of computer heat dissipation. The fixed supporting legs are fixedly mounted at four corners ofthe lower shell; Clamping column grooves are formed in the four corners of the upper surface of the lower shell. a clamping column is sleeved with the interior of the clamping column groove in a threaded manner; elastic clamping devices are arranged at four corners of the upper shell; the upper shell and the lower shell are connected in a threaded sleeving manner; it is convenient to carry out maintenance, cleaning and disassembly, wherein a heat dissipation device is movably connected between the rotating rod and the threaded rotating rod; When the notebook is placed on the upper surface ofthe upper shell to be fixed; When the notebook computer frame extrudes the arc-shaped plate, the sliding block installed at the lower end of the arc-shaped plate contracts backwards at the moment, thearc-shaped plate can be tightly attached to the upper frame and the lower frame of the notebook computer body under the action of elastic force after the notebook computer body is laid flat, and theanti-skid elastic pad arranged on the arc-shaped edge of the arc-shaped plate has anti-skid and protection effects.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a cooling rack device for a microcomputer. Background technique [0002] Notebook computers have the advantages of easy operation and portability, and are favored by consumers. At present, for notebook computers, in the confrontation between performance and portability, heat dissipation has become the most critical factor, and notebook heat dissipation has always been the bottleneck in the core technology of notebooks. Sometimes the laptop will crash inexplicably, usually because the system temperature is too high. In order to solve this problem, people have designed a cooling base, and a good base can prolong the life of the notebook computer. When the radiator fixes the notebook, the traditional outriggers are prone to side slipping and are not firm. The traditional radiator does not have the effect of moving and blowing air during the heat dissipation proce...

AI Technical Summary

Problems solved by technology

When the radiator fixes the notebook, the traditional outriggers are prone to side slipping and are not firm. The traditional radiator does not have the effect of moving and blowing air during the heat dissipation process. It is only fixed in one position for blowing, and cannot follow the fuselage. The temperature of different locations is blown synchronously, and the wind speed is consistent at any temperature, which leads to the fact that when the temperature is too high, the heat emitted by the notebook cannot be dissipated, which will affect the performance of the computer. When the heat generated by operation is dissipated, a large amount of heat energy will be generated. How to collect and reuse the heat energy has profound significance and application value

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