A microcomputer cooling rack device

A technology of a microcomputer and a heat sink, which is applied in computing, instruments, electrical and digital data processing, etc., can solve the problems of side sliding of the legs, synchronous blowing, and the radiator does not have a movable blower to dissipate heat. Stable fixation, easy maintenance and cleaning effect

Active Publication Date: 2019-04-05
长沙柳腾科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the radiator fixes the notebook, the traditional outriggers are prone to side slipping and are not firm. The traditional radiator does not have the effect of moving and blowing air during the heat dissipation process. It is only fixed in one position for blowing, and cannot follow the fuselage. The temperature of different locations is blown synchronously, and the wind speed is consistent at any temperature, which leads to the fact that when the temperature is too high, the heat emitted by the notebook cannot be dissipated, which will affect the performance of the computer. When the heat generated by operation is dissipated, a large amount of heat energy will be generated. How to collect and reuse the heat energy has profound significance and application value

Method used

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  • A microcomputer cooling rack device
  • A microcomputer cooling rack device
  • A microcomputer cooling rack device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1: refer to Figure 1-3 , a microcomputer cooling frame device, including a fixed leg 1, a lower casing 2 and an upper casing 9, and also includes a cooling device 6 and an elastic clamping device 11; the four corners of the lower casing 2 are fixedly installed with fixed Outrigger 1, the left side of the lower housing 2 is provided with a USB interface 3, the four corners of the upper surface of the lower housing 2 are fixedly connected with the column groove 10, the upper end of the card column groove 10 is movably socketed with the lower end of the card column 4, and the card The upper end of the column 4 is fixedly connected to the corner of the lower surface of the upper casing 9, the upper end is rotatably connected with a threaded screw 42 between the left-right and left-right symmetrical clamping columns 4, and the left-right symmetrical clamping column 4 at the lower end is rotationally connected with a rotating shaft. Rod 8, the rotating rod 8 is pr...

Embodiment 2

[0033] Embodiment 2: refer to Figure 4-5 , combined with the basis of Embodiment 1, the fixed leg 1 includes a sleeve 23 and a bracket frame 24, the upper surface of the bracket frame 24 is fixedly connected with an inner connecting pipe 29, the inner connecting pipe 29 is threadedly connected with the sleeve 23, and the side of the sleeve 23 is provided with a dial The moving rod 22, the other end of the moving rod 22 is fixedly connected with a moving head 21, the upper surface of the sleeve 23 is fixedly connected with a cylindrical block 25, the upper frame of the cylindrical block 25 is provided with an arc-shaped groove 27, and the inner movable contact of the cylindrical block 25 has a circle Shaped ball 20, the round ball 20 is away from the center surface and is fixedly connected with the upper end of the connecting rod 28, the lower end of the connecting rod 28 runs through the sleeve 23, the inner connecting pipe 29 and the bracket frame 24 in turn, and the bottom e...

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Abstract

The invention discloses a microcomputer heat dissipation frame device, and belongs to the technical field of computer heat dissipation. The fixed supporting legs are fixedly mounted at four corners ofthe lower shell; Clamping column grooves are formed in the four corners of the upper surface of the lower shell. a clamping column is sleeved with the interior of the clamping column groove in a threaded manner; elastic clamping devices are arranged at four corners of the upper shell; the upper shell and the lower shell are connected in a threaded sleeving manner; it is convenient to carry out maintenance, cleaning and disassembly, wherein a heat dissipation device is movably connected between the rotating rod and the threaded rotating rod; When the notebook is placed on the upper surface ofthe upper shell to be fixed; When the notebook computer frame extrudes the arc-shaped plate, the sliding block installed at the lower end of the arc-shaped plate contracts backwards at the moment, thearc-shaped plate can be tightly attached to the upper frame and the lower frame of the notebook computer body under the action of elastic force after the notebook computer body is laid flat, and theanti-skid elastic pad arranged on the arc-shaped edge of the arc-shaped plate has anti-skid and protection effects.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a cooling rack device for a microcomputer. Background technique [0002] Notebook computers have the advantages of easy operation and portability, and are favored by consumers. At present, for notebook computers, in the confrontation between performance and portability, heat dissipation has become the most critical factor, and notebook heat dissipation has always been the bottleneck in the core technology of notebooks. Sometimes the laptop will crash inexplicably, usually because the system temperature is too high. In order to solve this problem, people have designed a cooling base, and a good base can prolong the life of the notebook computer. When the radiator fixes the notebook, the traditional outriggers are prone to side slipping and are not firm. The traditional radiator does not have the effect of moving and blowing air during the heat dissipation proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/203G06F2200/201
Inventor 何涛何艳阳
Owner 长沙柳腾科技有限公司
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