Water cooling system and water cooling head
A water-cooled heat dissipation and water-cooled head technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems such as overheating of electronic components, serious heat accumulation, damage, etc., to avoid excessive heat accumulation Effect
Active Publication Date: 2020-11-10
泽鸿(广州)电子科技有限公司
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Problems solved by technology
For example, if figure 1 The heat-absorbing capacity of each water-cooled head is the same 4 degrees Celsius. When the first three water-cooled heads 11-13 absorb heat at the same time, the last water-cooled head 14 connected in series can be simply and linearly calculated to increase the temperature by 16 degrees Celsius. temperature, which may cause overheating and damage to electronic components
It is understandable that if there are more water-cooled heads connected in series in such pipelines, the heat accumulation will be more serious
Method used
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[0033]The following examples are proposed to describe the present invention in detail, and the examples are only used as examples for illustration and will not limit the scope of protection of the present invention. In addition, the drawings in the embodiments omit elements that are not necessary or can be completed by conventional techniques, so as to clearly show the technical characteristics of the present invention.
[0034] The implementation description of the present invention is now carried out with a first embodiment. See figure 2 , is a schematic top view of a water cooling system 200 proposed in the first embodiment. Such as figure 2 As shown, the water cooling system 200 mainly includes a pump 20 and a water cooling head 2 . The water-cooling system 200 is applied to an electronic device (not shown in the drawing), such as a computer device; and the pump 20 can be installed inside or outside the electronic device according to conditions or requirements for cir...
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The invention provides a water-cooling radiating and a water-cooling head. The system comprises a pump for transporting a fluid circularly and the water-cooling head. The water-cooling head comprisesa bottom, a first cavity and a second cavity. The bottom is used for contacting an electronic element. The first cavity and the second cavity are formed in the upper part of the bottom and are separated from each other. The first cavity is provided with a first inlet and a first outlet for circulating the fluid externally, the fluid at the first inlet is circulated to the pump and is input to thefirst cavity. The second cavity is provided with a second inlet and a second outlet for circulating the fluid externally, the fluid at the second inlet is circulated to the pump and is input to the second cavity. The fluid flows to the two cavities, the heat of the electronic element is absorbed by the fluid inside the two cavities through the bottom and is released after the fluid flows out of the first outlet and the second outlet respectively. Excessive accumulation of heat inside the water-cooling head can be avoided.
Description
technical field [0001] The present invention relates to a water-cooling heat dissipation system and a water-cooling head, in particular to a water-cooling heat dissipation system and the water-cooling head which are applied to an electronic device and have one or more water-cooling heads. Background technique [0002] With the advancement and popularization of science and technology, various electronic devices or computer equipment have already become indispensable in people's daily life, such as notebook computers, desktop computers, network servers and so on. Generally speaking, the temperature of the electronic components inside these products will increase during operation, and the high temperature will easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design for these electronic products. In general heat dissipation design, in addition to using fans to provide airflow for convection cooling, or attaching ...
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IPC IPC(8): H05K7/20
CPCH05K7/20272
Inventor 陈建安范牧树陈建佑
Owner 泽鸿(广州)电子科技有限公司