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System, method and computer program product for classifying a plurality of items

A defect classification and user-friendly technology, applied to computer parts, material analysis and calculation through optical means, can solve defects, incomplete capture, wafer deformation and other problems

Pending Publication Date: 2019-04-09
APPL MATERIALS ISRAEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Complex object manufacturing processes are not error-free, and these errors can lead to imperfections in manufactured objects
Defects may include defects that may impair the operation of an object, as well as nuisances that may be defects, but do not result in any damage or failure of the manufactured unit
As a non-limiting example, defects may arise during the manufacturing process due to imperfections in raw materials, mechanical, electrical, or optical errors, human error, or other causes
Furthermore, defects can be caused by spatiotemporal factors such as wafer temperature changes that occur after one or more fabrication stages during the inspection process, which can lead to some wafer distortion
The inspection process can also introduce additional so-called errors, for example caused by optical, mechanical or electrical problems in the inspection equipment or process, thus providing an incomplete capture

Method used

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  • System, method and computer program product for classifying a plurality of items
  • System, method and computer program product for classifying a plurality of items
  • System, method and computer program product for classifying a plurality of items

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Embodiment Construction

[0019] In the following detailed description, several specific details are set forth to provide a thorough understanding of the present invention. However, those skilled in the art will understand that the subject matter disclosed herein may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to obscure the subject matter disclosed herein.

[0020]Unless specifically stated otherwise, as will be apparent from the following discussion, it is understood that throughout the discussion of this specification terms such as "determine," "calculate," "process," "operate," "represent," "comparison," and "Generate", "estimate", "match", "process", "select" or similar terms refer to the act and / or processing of a computer that manipulates and / or transforms data into other data, said data represented as physical , such as electronic, quantitative and / or said data representing...

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PUM

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Abstract

The invention provides a system, a method and a computer software product. The system is capable of classifying defects and comprising: an hardware-based GUI component; and a processing and memory circuitry configured to: a. upon obtaining data informative of a plurality of defects and attribute values thereof, using the attribute values to create initial classification of the plurality of defectsinto a plurality of classes; b. for a given class, presenting to a user, by the hardware-based GUI component, an image of a defect initially classified to the given class with a low likelihood, wherein the image is presented along with images of one or more defects initially classified to the given class with the highest likelihood; and c. subject to confirming by the user, using the hardware-based GUI component, that the at least one defect is to be classified to the given class, indicating the at least one defect as belonging to the given class.

Description

technical field [0001] The subject matter disclosed herein relates to inspection objects (eg, wafers, reticles, etc.), and, more particularly, to classifying defects detected through captured images of the inspection objects, and to generating classification models. Background technique [0002] Current demands for high density and performance associated with very large scale integration of fabricated devices require sub-micron features, increased transistor and circuit speeds, and increased reliability. Such demands require forming device features with high precision and uniformity, which in turn necessitates careful monitoring of the fabrication process, including frequent and detailed inspection of the devices while they are still in semiconductor wafer form. [0003] The term "object" used in this specification should be interpreted broadly to cover samples of any kind of wafers, masks, and other structures used in the manufacture of semiconductor integrated circuits, ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06K9/62G06V10/762G06V10/764
CPCG06T7/001G06T2207/30148G06F18/214G01N21/9501G01N2021/8854G06N20/00G06V2201/06G06V10/762G06V10/764G06V10/945G06F18/23G06N5/022G06F3/0482G06F18/40G06F18/243G06F18/2415
Inventor 阿萨夫·阿斯巴克波阿斯·科恩
Owner APPL MATERIALS ISRAEL LTD