Light emitting diode package structure

Abstract

The invention relates to the technical field of light emitting diodes, in particular to a light emitting diode package structure. The light emitting diode package structure includes a crystal of a light emitting diode and further comprises a base, a fixing ring, a heat dissipating assembly, a heat dissipating wire, a lens and a transparent frame. The light emitting diode package structure is provided with the heat dissipating assembly, the fixing ring and the heat dissipating wire, heat generated by working of the light emitting diode is transmitted to the heat dissipating wire through the fixing ring, then the heat is transmitted to the heat dissipating assembly through the heat dissipating wire to realize timely heat dissipation of the crystal, and therefore the influence on the stimulating effect of phosphor powder coated on the crystal is avoided; the heat dissipating assembly consists of a clamping ring, heat dissipating fins and a connecting ring assembly, and the heat can be quickly dissipated through the heat dissipating fins; the lens is arranged, so that a light source emitted by the light emitting diode can be diffused through the lens to maximize the light emitting range; and meanwhile, hemispherical setting allows for uniform distribution of light throughout the lens, and uneven illumination range is avoided.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to a packaging structure of light emitting diodes. Background technique [0002] When the light-emitting diode is working, as the working time prolongs, a certain amount of heat is generated inside the package. Because the package in the prior art is completely sealed, the accumulated heat cannot be dissipated. To a certain extent, the coating inside the light-emitting diode The degree of excitation of the phosphor varies, which in turn affects the luminous efficiency. Contents of the invention [0003] The object of the present invention is to overcome the problems existing in the prior art and provide a light emitting diode packaging structure, which can dissipate the heat in the light emitting diode in time and avoid affecting the luminous efficiency. [0004] In order to achieve the above-mentioned technical purpose and achieve the above-mentioned technical effe...

AI Technical Summary

Problems solved by technology

[0002] When the light-emitting diode is working, as the working time prolongs, a certain amount of heat is generated inside the package. Because the package in the prior art is completely sealed, the accumulated heat cannot be dissipated. To a certain extent, the coating inside the light-emitting diode The degree of excitation of phosphors is different, which in turn affects the luminous efficiency

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