A kind of manufacturing method of metal mask board and metal mask board

Abstract

Embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular to a method for manufacturing a metal mask and the metal mask, which are used to limit the strain of the mask layer after it is separated from the base plate and maintain the metal mask. positional accuracy. Coating photoresist on the bottom plate; exposing and developing the photoresist to form a required pattern with a first opening; depositing metal in the first opening to form an electroforming layer; removing the remaining photoresist to obtain a mask layer, mask The layer includes at least one electroformed pixel area and an electroformed main body area; the electroformed pixel area includes at least one second opening and electroformed connection bridges separating the second openings; the electroformed main body area is attached to the flat plate included in the support frame and at least one electroformed pixel region is aligned with the third opening; the mask layer is separated from the base plate to obtain a metal mask plate. In this way, when the mask layer is separated from the bottom plate, the flat plate can provide support for the electroformed layer, limit the deformation of the metal mask, and maintain the positional accuracy of the metal mask.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular to a method for manufacturing a metal mask and the metal mask. Background technique [0002] During the production process of Organic Light-emitting Diode (OLED for short), vacuum evaporation technology is used to evaporate organic materials onto the surface of the substrate above the evaporation source. Before evaporation, it is necessary to stick a mask plate under the substrate, and an opening is reserved on the mask plate, so that the organic material can be deposited on the substrate through the opening area during evaporation. [0003] At present, the electroforming method is mostly used for metal masks. The principle is: in the opening formed after the exposure and development of the photoresist on the bottom plate, nickel-iron alloy is deposited to form an electroforming layer, and then the photoresist is removed to obtain a meta...

AI Technical Summary

Problems solved by technology

Since the electroformed layer and the base plate have different internal stresses, when the electroformed layer is separated from the base plate, due to the existence of the internal stress of the electroformed layer, the electroformed layer loses the strain limit of the base plate and deforms, resulting in positional accuracy. Displacement phenomenon, which makes the metal mask unusable

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