Nickel-gold plated treatment process for blind hole surface of circuit board

A treatment process, nickel-gold electroplating technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of blind hole electroplating, the solution can not be fully poured, blind hole solution exchange is difficult, etc., to achieve increased Exchange efficiency, improve the plating quality of blind holes, and improve the effect of plating quality

Inactive Publication Date: 2019-04-19
合肥中航天成电子科技有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The circuit board is one of the important parts of the electronics industry. It has the characteristics of high wiring density, light weight, and thin thickness. The circuit board is generally provided with metalized blind holes for installing and fixing devices on it to achieve certain specific requirements. Generally, it is necessary to carry out nickel-gold plating on the surface of blind holes; for blind holes with small diameter and large depth, on the one hand, the solution cannot be completely filled because the air bubbles residing in the blind holes are difficult to get rid of; on the other hand On the one hand, due to the effect of the surface tension of the solution, capillaries will appear in smaller blind holes. Now, after the solution enters the blind hole, the pressure inside the blind hole is often greater than the pressure outside the blind hole, which makes it difficult to exchange the solution inside the blind hole. Therefore, Blind hole electroplating has the problem of not being able to plate

Method used

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  • Nickel-gold plated treatment process for blind hole surface of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Step 1: Prepare a circuit board with metallized blind holes on the surface; here, the size of the blind holes is: the depth of the blind hole is 1.00mm, and the diameter of the blind hole is 0.25mm.

[0023] Step 2: Treat the surface of the metallized blind hole by washing with water.

[0024] Step 3: Before nickel-gold electroplating, remove the air bubbles in the metallized blind holes by ultrasonic; the ultrasonic time before plating is 10 minutes, and the frequency is 45KHZ.

[0025] Step 4: According to the material of the circuit board, set the current parameter of electroplating, and electroplate nickel gold on the surface of the metallized blind hole; here, the circuit board is made of alumina ceramic plate, so the current parameter of electroplating is 1.4A; The surface of the metallized blind hole is electroplated with nickel and gold. Specifically, the electroplating tank is filled with electroplating solution, the circuit board is immersed in the electroplat...

Embodiment 2

[0029] The current parameters of the electroplating were changed to 1.5A; the angle of the swinging motion was changed to 30°. All the other conditions are the same as in Example 1.

Embodiment 3

[0031] The current parameters for electroplating were changed to 1.6A; the angle of the swinging motion was changed to 20°. All the other conditions are the same as in Example 1.

[0032] In this embodiment: the electroplating result is specifically that the plating layer in the metallized blind hole is complete, and the bonding force of the plating layer is qualified.

[0033] In addition to this, a control group is also provided here:

[0034] Control group one:

[0035] Before nickel-gold plating, ultrasonic treatment is not used, that is, step 2 is removed, and the rest is the same as in embodiment 1.

[0036] Control group two:

[0037] Before nickel-gold plating, dithering treatment is not used, that is, step five is removed, and the rest is the same as in embodiment one.

[0038] The electroplating result of each embodiment and control group participates in Table 1:

[0039]

[0040] Table 1

[0041] Comparing the electroplating results of Example 1 and the con...

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Abstract

The invention discloses a nickel-gold plated treatment process for a blind hole surface of a circuit board. The process comprises the following steps of: step 1: preparing a circuit board having metallized blind holes in the surface; step 2: processing the surface of the metallized blind holes through water washing; step 3: before electroplating nickel gold, removing the bubbles in the metallizedblind holes through ultrasonic waves; step 4: according to the material of the circuit board, setting the current parameters of the electroplating, and carrying out nickel-gold electroplating on the surfaced of the metallized blind holes; step 5: during the nickel-gold electroplating process, continuously shaking the circuit board to accelerate the flow of the electroplating solution and dischargethe bubbles on the surfaces of the metallized blind holes; and step 6: after the nickel-gold electroplating is completed, stopping the shaking. According to the invention, by properly exchanging theelectroplating solution in the metallized blind holes, the problem that the metallized blind holes fail to be electroplated is solved.

Description

technical field [0001] The invention belongs to the technical field of circuit board electroplating, and in particular relates to a nickel-gold plating treatment process on the surface of a blind hole of a circuit board. Background technique [0002] The circuit board is one of the important parts of the electronics industry. It has the characteristics of high wiring density, light weight, and thin thickness. The circuit board is generally provided with metalized blind holes for installing and fixing devices on it to achieve certain specific requirements. Generally, it is necessary to carry out nickel-gold plating on the surface of blind holes; for blind holes with small diameter and large depth, on the one hand, the solution cannot be completely filled because the air bubbles residing in the blind holes are difficult to get rid of; on the other hand On the one hand, due to the effect of the surface tension of the solution, capillaries will appear in smaller blind holes. Now...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/423
Inventor 阚云辉陈真
Owner 合肥中航天成电子科技有限公司
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