Novel communication method based on combination of air chip and quantum communication technology
A technology of quantum communication and communication method, which is applied in the field of communication, and can solve problems such as high cost, low quantum key generation speed, and low quantum key coding rate
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Embodiment 1
[0023] A new type of communication method based on the combination of air chip and quantum communication technology, including multiple communication sites connected in sequence, the multiple communication sites include a central communication site and multiple secondary communication sites; also includes an air chip with an unstable shape , the air chip includes a first electrode layer, a functional material layer, a second electrode layer, a third computing layer, and a cloud transmission layer connected in sequence, wherein: the first electrode layer is used to simulate a post-synapse, and the second electrode layer The two electrode layers are used to simulate the pre-synapse, the material of the functional material layer is a chalcogenide compound, and the conductance of the functional material layer is used to simulate the synapse weight; by applying a second pulse signal to the first electrode layer Simulate post-synaptic stimulation by applying a first pulse signal to t...
Embodiment 2
[0026]Further, as a preferred solution of the present invention, the secondary communication site includes a quantum communication terminal, a photonic device, and an optical switch, and the IN port of the optical switch in each secondary communication site can be controlled by the quantum communication server. Point to the OUT port of the local optical switch or the local photonic device. The quantum communication terminal of the central communication site is used to obtain the quantum key corresponding to the target secondary communication site stored in advance in the quantum key distribution process from the local key storage space, and use the quantum key Perform corresponding quantum encryption communication with the target secondary communication site. The air chip is a 3D memory chip; the air chip includes an isolation layer, a first insulating film, a circular upper chip, a circular lower chip, and a supporting layer; the circular upper chip has a protrusion facing th...
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