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Intelligent air chip

A chip and air technology, applied in the field of smart air chips, can solve the problem that fine dust cannot be better detected or collected, and achieve high storage capacity, high-speed storage capacity, and low energy consumption.

Inactive Publication Date: 2019-01-22
有份儿智慧科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a smart air core to solve the problem of smart dust consisting of a microprocessor, a two-way wireless receiving device, and a wireless network. In the environment, the dust cannot better detect or collect information. We need to endow the chip with such a function, but it must be applicable to all electronic products, which has become a major research problem.

Method used

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  • Intelligent air chip

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Embodiment 1

[0023] An intelligent air chip, including intelligent dust composed of a microprocessor, a two-way wireless receiving device, and a wireless network. The two-way wireless receiving device collects data and transmits information to the microprocessor, and the microprocessor transmits information to the cloud coefficient library of the base station; it also includes an air chip with an unstable shape, and the air chip includes a first electrode layer connected in sequence, Functional material layer, second electrode layer; also includes a third computing layer connected to the second electrode layer and a cloud transfer layer, wherein: the first electrode layer is used to simulate post-synapse, and the second electrode layer is used to Before simulating a synapse, the material of the functional material layer is a chalcogenide compound, and the conductance of the functional material layer is used to simulate a synaptic weight; by applying a second pulse signal to the first electr...

Embodiment 2

[0026]The difference between embodiment 2 and embodiment 1 is that the air chip is a 3D memory chip. The air chip includes an isolation layer, a first insulating film, a circular upper chip, a circular lower chip, and a support layer; the circular upper chip has a bump protruding toward the circular lower chip, and the bumps There is a first through hole, the first insulating film covers the surface of the bump and the opening of the first through hole on the surface of the bump; the circular lower chip has a second through hole, so The isolation layer covers the opening of the second through hole on the surface of the circular lower chip; the support layer is fixed on the surface of the circular lower chip, and sandwiched between the circular upper chip and the circular chip. Between the shaped lower chips, the bumps of the circular upper chip are clamped into the grooves formed by the support layer, so that the circular upper chip, the circular lower chip and the support lay...

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Abstract

The invention discloses an intelligent air chip, including an intelligent dust composed of a microprocessor, a two-way wireless receiving device and a wireless network, wherein the intelligent dust scatters some fine dust in a site through the wireless network, so that they can be mutually positioned, and the two-way wireless receiving device further collects data and transmits information to themicroprocessor, which transmits information to a cloud coefficient library of a base station; the intelligent air chip also includes: an air chip with changed forms, the air chip comprises a first electrode layer, a functional material layer and a second electrode layer which are connected in turn, and a third computing layer and a cloud transmission layer which are connected with the second electrode layer. The first electrode layer is used for simulating postsynaptic, the second electrode layer is used for simulating presynaptic, the material of the functional material layer is chalcogenide, and the conductivity of the functional material layer is used for simulating synaptic weight; Postsynaptic stimulation is simulated by applying a second pulse signal to the first electrode layer.

Description

technical field [0001] The invention belongs to the technical field and relates to an intelligent air chip. Background technique [0002] The Pentagon of the United States proposed the design idea of ​​"smart dust", which aims to scatter thousands of tiny wireless sensors on the battlefield to monitor the enemy's activities without letting the enemy notice. By self-organizing a wireless sensor network, "smart dust" will filter relevant raw data and send important information to Central Command. The characteristics of "smart dust" are small size, low power consumption, self-organization, and wireless communication, which are also the characteristics of networked micro sensors. The U.S. Army has planned to develop a multi-level integrated sensor system—Smart Sensor Network Communication (SSNC), which is a Science and Technology Objective (STO) program in the U.S. fiscal year 2001. It is a very good example of networked miniature sensors in the military field. Applications. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K17/00G06K19/077G06N3/063H04L29/08
CPCG06K17/0022G06K19/0772G06N3/063H04L67/1097
Inventor 易霄
Owner 有份儿智慧科技股份有限公司
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