Intelligent air chip
A chip and air technology, applied in the field of smart air chips, can solve the problem that fine dust cannot be better detected or collected, and achieve high storage capacity, high-speed storage capacity, and low energy consumption.
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Embodiment 1
[0023] An intelligent air chip, including intelligent dust composed of a microprocessor, a two-way wireless receiving device, and a wireless network. The two-way wireless receiving device collects data and transmits information to the microprocessor, and the microprocessor transmits information to the cloud coefficient library of the base station; it also includes an air chip with an unstable shape, and the air chip includes a first electrode layer connected in sequence, Functional material layer, second electrode layer; also includes a third computing layer connected to the second electrode layer and a cloud transfer layer, wherein: the first electrode layer is used to simulate post-synapse, and the second electrode layer is used to Before simulating a synapse, the material of the functional material layer is a chalcogenide compound, and the conductance of the functional material layer is used to simulate a synaptic weight; by applying a second pulse signal to the first electr...
Embodiment 2
[0026]The difference between embodiment 2 and embodiment 1 is that the air chip is a 3D memory chip. The air chip includes an isolation layer, a first insulating film, a circular upper chip, a circular lower chip, and a support layer; the circular upper chip has a bump protruding toward the circular lower chip, and the bumps There is a first through hole, the first insulating film covers the surface of the bump and the opening of the first through hole on the surface of the bump; the circular lower chip has a second through hole, so The isolation layer covers the opening of the second through hole on the surface of the circular lower chip; the support layer is fixed on the surface of the circular lower chip, and sandwiched between the circular upper chip and the circular chip. Between the shaped lower chips, the bumps of the circular upper chip are clamped into the grooves formed by the support layer, so that the circular upper chip, the circular lower chip and the support lay...
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