A Planar Ultrasonic Vibration Assisted Machining Platform

Abstract

The invention discloses a plane supersonic vibration auxiliary machining platform. The plane supersonic vibration auxiliary machining platform comprises a rectangular base body. A rectangular groove is formed in the middle of the rectangular base body. A moving platform is arranged in the center of the rectangular groove through a decoupling support pillar, wherein the decoupling support pillar ismade of a transverse isotropy material. A piezoelectric ceramic driver is arranged between each of four inner side edges of the rectangular base body and the moving platform. The plane end of each piezoelectric ceramic driver is in surface contact connection with the corresponding inner side edge of the rectangular base body. The arc-surface end of each piezoelectric ceramic driver is in point connection with the moving platform. Pre-tightening bolts are arranged at the positions, corresponding to the piezoelectric ceramic drivers, of the four edges of the rectangular base body, wherein the pre-tightening bolts are in threaded connection and penetrate the edges. The pre-tightening bolts are used for conducting adjustive pre-tightening on contact connection between the moving platform andthe piezoelectric ceramic drivers. By means of the plane supersonic vibration auxiliary machining platform, a whole system can achieve sufficient rigidity and stability and the high-precision and high-reliabilty supersonic vibration auxiliary functions with the controllable amplitude and frequency.

Description

technical field [0001] The invention relates to a processing platform. In particular, it relates to a planar ultrasonic vibration assisted processing platform. Background technique [0002] Micro-nano scribing processing technology based on scanning probe has been more and more widely used in micro-nano scale processing due to its simple structure, low cost, high precision, and ability to scribe arbitrary patterns. However, the probe directly marks the surface of the sample - "plowing" processing, which has the inherent disadvantages of large processing normal force, easy accumulation of chips, and slow marking speed, and cannot directly mark high-hardness materials, viscoelastic materials, etc. Materials with special properties, such as materials, severely limit the scope of application of probe scribing. For this reason, various energy-assisted methods for probe scribing have been researched, including probe heating, electrochemical machining, vibration-assisted machinin...

AI Technical Summary

Problems solved by technology

However, the probe directly marks the surface of the sample - "plowing" processing, which has the inherent disadvantages of large processing normal force, easy accumulation of chips, and slow marking speed, and cannot directly mark high-hardness materials, viscoelastic materials, etc. Materials with special properties, such as materials, severely limit the application range of probe scribing

For this reason, various energy-assisted methods for probe scribing have been developed, including probe heating, electrochemical machining, vibration-assisted machining, etc. Among them, vibration-assisted machining has simple principles, strong material adaptability, and can be used in natural However, most existing ultrasonic vibration auxiliary platforms have shortcomings such as motion coupling and limited frequency.

Images