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fluid supply device

A fluid supply device and fluid supply technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as residual impurities

Active Publication Date: 2020-12-08
SCIENTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the nozzle supplies liquid or gas to the surface of the substrate with high-speed liquid flushing, and when the substrate to be processed has deep grooves, impurities may still remain in the grooves

Method used

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Embodiment Construction

[0050] In order to enable your review committee members to better understand the technical content of the present invention, the preferred specific embodiments are described as follows.

[0051] Please refer to the following Figure 1 to Figure 7 Regarding the fluid supply device of the first embodiment of the present invention. figure 1 It is a schematic diagram of the fluid supply device of the first embodiment of the present invention; figure 2 It is a schematic diagram of the fluid supply device when performing the blasting process according to the first embodiment of the present invention; image 3 It is a schematic diagram of the fluid supply device when performing the wet process according to the first embodiment of the present invention; Figure 4 It is a schematic diagram of the fluid supply device when the blasting process is performed again according to the first embodiment of the present invention; Figure 5 It is a schematic diagram of the fluid supply device ...

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Abstract

Disclosed is a kind of fluid supply device used to process a substrate comprising a non-planar region. The fluid supply device includes a fluid supply unit and a gas supply unit. The fluid supply unit is used to output a fluid along the substrate. The gas supply unit is located outside the fluid supply unit and includes a gas output unit, wherein the gas output unit is used to output a first gas along the substrate. When the fluid supply unit outputs the fluid along the substrate, a wet process can be performed on the non-planar region. When the gas output unit outputs the first gas along the substrate and the first gas flows in a direction horizontal to the substrate, the first gas is used for a removal process of removing the fluid on the non-planar region.

Description

technical field [0001] The invention relates to a fluid supply device, in particular to a fluid supply device for effectively treating the surface of a substrate. Background technique [0002] In the substrate process, the surface of the substrate is often cleaned to remove impurities on the surface of the substrate. When cleaning the surface of the substrate, the principle of high-speed flow of compressed air is usually used to let the existing nozzle provide the flowing liquid toward the wafer surface, or use a steam generator to form the liquid into high-pressure steam, and then supply the high-pressure steam to the substrate surface. This allows flowing liquid or high-pressure steam to clean the surface of the substrate. [0003] However, the nozzles supply liquid or gas to the surface of the substrate with high-speed liquid flushing, and when the substrate to be processed has deep grooves, impurities may still remain in the grooves. In addition, high-pressure steam i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67028H01L21/67051H01L21/6708H01L21/6715
Inventor 冯傳彰
Owner SCIENTECH