Diode and manufacturing method, array substrate and display panel thereof

A technology of array substrates and diodes, applied in the fields of final product manufacturing, sustainable manufacturing/processing, instruments, etc., can solve problems such as increased power consumption, poor photosensitive diodes, and limited availability of diodes, so as to reduce power consumption and increase photosensitivity , the effect of good diode characteristics

Active Publication Date: 2019-04-26
XIAMEN TIANMA MICRO ELECTRONICS
View PDF4 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides a diode and its manufacturing method, an array substrate, and a display panel, aiming to solve the problem of poor photosensitivity of the diode in the prior art, which requires the use of a strong light source to improve the photosensitivity, but the use of a strong light source will lead to poor performance. The problem of increased power dissipation, thus limiting the practical availability of the diode

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diode and manufacturing method, array substrate and display panel thereof
  • Diode and manufacturing method, array substrate and display panel thereof
  • Diode and manufacturing method, array substrate and display panel thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0037] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0038] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0039] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a diode and a manufacturing method, an array substrate and a display panel thereof, and belongs to the technical field of display. The diode comprises a substrate, a buffer layer is arranged on one side of the substrate, a first film, a second film and a third film are arranged on one side of the buffer layer away from the substrate, the first film is a polysilicon film, the second film is an amorphous silicon film, and the third film is the polysilicon film or the amorphous silicon film; a diode includes at least a first portion, a second portion, a third portion, a first electrode and a second electrode, the first portion is located in the first film, the second portion is located in the second film, and the third portion is located in the third film; the first electrode is electrically connected to the first portion, and the second electrode is electrically connected to the third portion. The light flux and the photosensitivity of the diode can be increased while the absorption of the light by the diode is ensured, the power consumption of a light source can be reduced favorably, the process is simplified, and the production efficiency is improved.

Description

technical field [0001] The present invention relates to the field of display technology, and more specifically, to a diode and a manufacturing method thereof, an array substrate, and a display panel. Background technique [0002] With the continuous development of electronic technology, fingerprint recognition is widely used in the display screens of electronic devices such as mobile phones, personal digital assistants, and computers. Embedding a fingerprint identification device into the display area is one of the research topics in the display field. Embedding it in the display area can save the front display area of ​​a mobile phone or mobile device and improve user experience. Now, before operating the display device with the fingerprint recognition function, the user only needs to touch the display device with a finger to perform authority verification, which simplifies the authority verification process. Existing display panels with fingerprint recognition function al...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/105H01L31/20G06K9/00
CPCH01L31/1055H01L31/202G06V40/1318H01L27/14678H01L27/14692G06V40/1329H01L27/14603H01L27/1461H01L27/14623Y02P70/50G06V40/1365
Inventor 刘博智史晓琪蔡寿金蓝学新陈国照
Owner XIAMEN TIANMA MICRO ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products