Check patentability & draft patents in minutes with Patsnap Eureka AI!

Integral substrate for camera module array, and manufacturing method and mold thereof

The technology of a camera module and its manufacturing method, which is applied in the field of optics, can solve problems such as increased cost and increased module size, and achieve the effects of improving strength, ensuring imaging accuracy, and ensuring reliability

Pending Publication Date: 2019-04-26
NINGBO SUNNY OPOTECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above scheme also has problems such as increased module size and increased cost.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integral substrate for camera module array, and manufacturing method and mold thereof
  • Integral substrate for camera module array, and manufacturing method and mold thereof
  • Integral substrate for camera module array, and manufacturing method and mold thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0056] It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

[0057] In the drawings, the thickness, size and shape of objects have been slight...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The application discloses an integral substrate for a camera module array, comprising the following parts: a circuit board, having a first region corresponding to a first lens component and a second region corresponding to a second lens component; a first molding portion, formed on the first surface of the circuit board, and covering at least a part of the first surface corresponding to the firstregion; and a second molding portion, integrally formed on the second surface opposite to the first surface of the circuit board through molding process, and covering at least a part of the second surface corresponding to the first region, and at least a part corresponding to the second region, wherein the integral substrate is provided with a first formation plane suitable for mounting a first photosensitive element and a second formation plane suitable for mounting a second photosensitive element. The invention further discloses a corresponding manufacturing method of the integral substrate,several devices including the integral substrate, and a manufacturing method of the devices. The invention can improve the strength of the substrate, improve the imaging quality of the camera modulearray, and reducing the cost.

Description

technical field [0001] The present application relates to the field of optical technology, in particular to an integrated substrate for camera module arrays, methods and molds for making them, photosensitive components including them, methods and molds for making photosensitive components, camera module arrays including them, manufacturing A method for camera module arrays. Background technique [0002] With the continuous development of smart devices, the requirements for camera modules are getting higher and higher. For example, in the past two years, the camera of a smart phone has changed from a single camera to a dual camera, and the development of a dual camera module has also become an important trend in the development of mobile phone camera modules. To put it simply, dual cameras can collect images through the cooperation of two cameras, so as to achieve richer image collection functions. The existing dual cameras can be divided into two categories according to th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225G02B7/00G03B17/12G03B17/14G03B30/00
CPCH04M1/0264G02B7/006G03B17/12G03B17/14H04N23/45H04N23/54H04N23/50H04N23/57H04N23/55
Inventor 方银丽梅哲文赵波杰田中武彦苏小娟陈振宇
Owner NINGBO SUNNY OPOTECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com