A method for manufacturing a rigid-flex board and a rigid-flex board
A technology of a soft-rigid combination board and a manufacturing method, which is applied in the manufacture of printed circuits, the structural connection of printed circuits, the reduction of crosstalk/noise/electromagnetic interference (etc.) Pursuit and other issues to achieve the effect of reducing transmission loss, improving shielding performance, and reducing size
Active Publication Date: 2020-04-28
VIVO MOBILE COMM CO LTD
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Problems solved by technology
[0011] Embodiments of the present invention provide a method for manufacturing a rigid-flex board and a rigid-flex board, so as to solve the problems in the design of the rigid-flex board in the prior art that do not meet the pursuit of lightness and thinness, poor bending performance and shielding performance, and limitations problem with circuit design
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[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0037] The embodiment of the present invention provides a method for manufacturing a rigid-flex board, wherein the design idea for the manufacture of a rigid-flex board is: design the traditional two-layer structure in the soft board area into a layer of copper structure, and change the material of the circuit conduction , The copper of the copper clad laminate is changed to the electromagnetic shielding film. Since the amount of copper in the copper cl...
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Abstract
The invention provides a manufacturing method of a soft and hard combined plate, and the soft and hard combined plate. The manufacturing method comprises the steps that a soft plate structure is provided; adhesion layers are arranged on the two end faces of the soft plate structure; outer-layer copper is pressed in two or more spaced preset areas of each adhesion layer, thus two or more hard plateareas are formed, a soft plate area is formed between every two hard plate areas, and the preset areas on the two adhesion layers and the outer-layer copper are arranged correspondingly; insulating materials are arranged on the surfaces of the two adhesion layers and the surfaces of all the pieces of outer-layer copper, and thus two insulating layers are formed; two or more conduction layers communicating with the first outer layer copper on the hard plate areas are formed on at least one of the insulating layers; open grooves penetrating through the insulating layers and the adhesion layersare formed in the preset positions of the one or two end faces of at least one of the soft plate areas; electromagnetic shielding films connected with the conduction layers are arranged along the inner wall of at least one of the open grooves and the surfaces of the insulating layers; and the electromagnetic shielding films are pressed and baked to form the soft and hard combined plate. Accordingto the manufacturing method of the soft and hard combined plate, the conduction property can be provided, the size of the soft plate area is decreased, and the utilization rate of a soft plate is increased.
Description
technical field [0001] The invention relates to the technical field of electronic products, in particular to a method for manufacturing a rigid-flex board and a rigid-flex board. Background technique [0002] With the continuous expansion of the market demand for portable electronic products, terminal equipment is becoming more and more thin, short and multi-functional. Among them, the application of flexible boards for high-density interconnection structures has greatly promoted the development of flexible printed circuit technology. [0003] In the process of the development of printed circuit technology, the development and research of RF-PCB (Rigid-Flex Printed Circuit Board, rigid-flex board) has received more and more attention, and because the rigid-flex board has good durability and flexibility , which is more suitable for medical and military fields, making the production and application of soft and hard boards more and more extensive. [0004] The four-layer flex...
Claims
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IPC IPC(8): H05K3/36H05K1/14H05K1/02
CPCH05K1/0216H05K1/147H05K3/361H05K2201/0715
Inventor 毛星
Owner VIVO MOBILE COMM CO LTD