A high-efficiency automatic pcb transplantation equipment

Abstract

The invention provides an efficient automatic transplanting device comprising a hood combination, a transfer rail, a translation mechanism, a grasping mechanism, a Y-axis mechanism, an X-axis combination and a carrier lifting platform. The hood assembly comprises an upper hood, a frame and a working table, the hood combination is divided by the working table into the upper hood and the frame, theframe is internally equipped with a mounting plate which separates the frame into two parts with different spaces, the carrier lifting platform is fixedly installed in a part with a large space in theframe, the upper surface of an upper cylinder mounting plate of a carrier lifting platform is level with an upper surface of the working table, the working table of a step structure is equipped witha transfer channel at a lower step position, the transfer rail is installed at the lower step position and remaining positions on two sides are balanced, the remaining positions at the two sides are equipped with the translation mechanism and the Y-axis mechanism, the translation mechanism and the Y-axis mechanism are parallel to each other and are arranged in the same direction, the X-axis combination is installed between the translation mechanism and the Y-axis mechanism, and the X-axis combination is equipped with the grasping mechanism.

Description

technical field [0001] The invention belongs to printed PCB transplantation technology, in particular to a high-efficiency and automatic aligning transplantation device. Background technique [0002] In the design of PCB, according to the needs of transportation or storage, as well as various other needs, the circuit substrate of a single unit is often combined into a contiguous structure formed by multiple substrates. As we all know, there are many production processes of PCB, and the simple Dozens of processes to complex hundreds of processes, each process cannot guarantee 100% qualified products, which means that sometimes one or several sub-circuit boards of the printed circuit boards with continuous structure are unqualified. If it is applied to the assembly equipment, the program of the assembly equipment needs to be re-arranged and designed. Because there are different scrapping arrangements, there will be many programs that need to be re-set, which will result in man...

AI Technical Summary

Problems solved by technology

At present, the above-mentioned transplantation process is all done manually, and the process of joining and aligning the sub-circuit board and the mother circuit board requires operators who are especially careful, skilled, and responsible, otherwise it will cause poor positioning of the mother board and daughter board. In the end, the transplanted joint PCB will be dislocated during SMT (Surface Mount Soldering), which will cause greater scrap loss, and it will take more time for the operator to complete the docking of the sub-board and the mother board. , low efficiency

[0004] PCB transplantation technology is developing rapidly. When transplanting, it is necessary to accurately transplant the sub-board to the corresponding gap position of the motherboard, and at the same time inject glue at the gap, and then transfer it to the designated position for high-temperature baking. Displacement deviation, the accuracy of alignment is reduced

Cause trouble or even scrapping of subsequent patches

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