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A kind of fingerprint recognition chip and its manufacturing method and electronic device

A fingerprint identification and manufacturing method technology, applied in character and pattern recognition, instruments, calculations, etc., can solve problems such as unsightly appearance, weak fingerprint signal, and small glass cover

Active Publication Date: 2021-12-21
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the weak fingerprint signal, the glass cover cannot be larger than 300um. The fingerprint chip placed on the front of the mobile phone can only open holes or partially thin the glass cover, which brings difficulty in processing and is not beautiful.

Method used

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  • A kind of fingerprint recognition chip and its manufacturing method and electronic device
  • A kind of fingerprint recognition chip and its manufacturing method and electronic device
  • A kind of fingerprint recognition chip and its manufacturing method and electronic device

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Embodiment Construction

[0046] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0047] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0048] It will be understood that when an element or layer is referred t...

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PUM

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Abstract

The present invention provides a fingerprint identification chip and its manufacturing method and electronic device, comprising: a substrate, the substrate includes a first surface and a second surface oppositely arranged; a plurality of pixels, arranged on the first surface of the substrate On the surface, wherein each of the pixels includes a photoelectric conversion element disposed in the substrate; a protective layer covering the first surface of the substrate; and a hole disposed in the protective layer above each of the pixels , and the hole is opposite to part of the photoelectric conversion element in the pixel; a cover plate, the cover plate covers the top opening of the hole and the protective layer. The holes arranged above the pixels can reduce the loss of optical signals for fingerprint identification, greatly enhance the photoelectrons generated by the photoelectric conversion element, thereby achieving the effect of enhancing the sensitivity of the fingerprint identification chip.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a fingerprint recognition chip, a manufacturing method thereof, and an electronic device. Background technique [0002] Nowadays, mobile phones have become an indispensable part of people's daily life. Due to the frequent use, it is inconvenient for users to repeatedly enter passwords. Therefore, with a fingerprint recognition system, identity confirmation can be easily completed in just one second, making users feel It is more convenient and quicker. Therefore, fingerprint recognition has become the standard configuration of mainstream mobile phones at present, and optical recognition is a main method in fingerprint recognition. [0003] At present, the trend of mobile phones is full screen, and the fingerprint chip needs to be front-mounted (that is, on the same side of the display screen). In order to realize the front-mounted fingerprint chip, it is often necessary to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
Inventor 陈文磊王奇峰
Owner SEMICON MFG INT (SHANGHAI) CORP