Ultrasonic lapping device

A grinding device and ultrasonic technology, applied in grain processing, etc., can solve the problems of reducing the grinding efficiency, the grinding device cannot meet the grinding requirements, etc., and achieve the effect of improving the grinding efficiency and uniform slurry

Pending Publication Date: 2019-05-07
NORTHERN ALTAIR NANOTECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the samples of the material mixture are all carried out through the traditional grinding device. Although the grinding device is much improved compared with the mortar grinding method, as the particle size of the material decreases, the existing grinding device cannot meet the grinding requirements, because the grinding slurry The agglomeration of the material gradually increases with the decrease of the particle size of the material, and the agglomeration of the material reduces the grinding efficiency to a certain extent.

Method used

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Embodiment 1

[0016] Embodiment 1 of the present invention provides an ultrasonic grinding device, such as figure 1 As shown, it includes a grinding body 1 with a grinding chamber 11, a discharge pipe 2, a buffer tank 3 and a feeding pipe 4 connected in sequence, and the feeding pipe 4 is connected with the grinding body 1, and the bottom of the grinding body 1 is arranged There is a discharge port 14, which is characterized in that it further includes an ultrasonic generator 5 and a transducer 6, the ultrasonic generator 5 is arranged between the buffer tank 3 and the feed pipe 4 and the lower section of the buffer tank 3 is placed on the ultrasonic generator 5 In the process, the transducer 6 is connected to the ultrasonic generator 5, so that by adding the ultrasonic generator 5 and the transducer 6, the material is ultrasonically dispersed in advance before entering the grinding body again.

[0017] Embodiment 2 of the present invention provides an ultrasonic grinding device, such as ...

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PUM

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Abstract

The invention discloses an ultrasonic lapping device comprising a lapping body with a lapping cavity, a discharging pipe, a buffer tank and a feeding pipe which are connected with each other in sequence; the feeding pipe is connected with the lapping body, and the bottom of the lapping body is provided with a discharging port; the ultrasonic lapping device further comprises an ultrasonic generatorand a transducer; the ultrasonic generator is arranged between the buffer tank and the feeding pipe, and the lower section of the buffer tank is arranged in the ultrasonic generator; and the transducer is connected with the ultrasonic generator. According to the ultrasonic lapping device, the lower section of the buffer tank is arranged in the ultrasonic generator, so that materials are subjectedto ultrasonic dispersion through the dispersion function of the ultrasonic generator in advance before reentering the lapping body; and thus, slurry is more uniform, and the lapping efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of mixing devices, and in particular relates to an ultrasonic grinding device. Background technique [0002] At present, the samples of the material mixture are all carried out through the traditional grinding device. Although the grinding device is much improved compared with the mortar grinding method, as the particle size of the material decreases, the existing grinding device cannot meet the grinding requirements, because the grinding slurry The agglomeration phenomenon of the material gradually increases with the decrease of the particle size of the material, and the agglomeration of the material reduces the grinding efficiency to a certain extent. Contents of the invention [0003] The object of the present invention is to provide an ultrasonic grinding device, which reduces the degree of agglomeration of small-diameter particles in the slurry through an ultrasonic generator, and improves the grindin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C19/18
Inventor 成信刚马书良雷磊白岩赵杰杨王科袁雪亚董阳阳王晓静
Owner NORTHERN ALTAIR NANOTECH CO LTD
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