Higher harmonic receiving and dispatching split type ultrasonic wave probe
A high-order harmonic and ultrasonic technology, applied in the direction of material analysis, measurement device, and material analysis using sonic/ultrasonic/infrasonic waves, can solve the problems of weak acquisition signal strength, low transmission efficiency, weak signal, etc., to achieve high strength The effect of transmitting and ensuring the signal-to-noise ratio
Inactive Publication Date: 2019-05-14
CHINA JILIANG UNIV
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Problems solved by technology
In the production of traditional ultrasonic probes, PZT piezoelectric ceramic materials are usually used as the transmitting chip. Although its transmitting performance is good and the signal strength is high, but the frequency band is narrow, it cannot be used as a receiving chip to smoothly collect high-order harmonic signals.
However, if the PVDF piezoelectric film is used for self-sensing and self-receiving measurement, although the PVDF piezoelectric film has a very wide frequency band, its signal is weak, the transmission efficiency is low, and the acquisition signal strength is weak
Method used
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[0017] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0018] like figure 1 As shown, the ultrasonic probe includes: a transmitting chip 1 , a filling resin material 2 , a receiving chip 3 , a backing 4 and an acoustic lens 5 . The transmitting chip, the receiving chip and the filling resin material form a 64-element line array; the receiving chip 3 is located on the central axis between the transmitting chips 1 and is isolated from electrical signals by the filling resin material 2; one part of the filling resin material 2 One side is the backing 4, and the other side is on the same plane as the transmitting chip 1 and receiving chip 2, and the acoustic lens 5 is covered on it. During the measurement process, the backing 4 is in contact with the sample through a polymer to protect the wafer. If the receiving chip 3 needs to receive the nth harmonic reflected by the sample, the thickness of the...
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The invention discloses a higher harmonic receiving and dispatching split type ultrasonic wave probe. The higher harmonic receiving and dispatching split type ultrasonic wave probe comprises launchingwafers (1), resin filling materials (2), receiving wafers (3), backings (4) and acoustic lenses (5). A 64 array element linear array is formed by the launching wafers (1), the receiving wafers (3) and the resin filling materials (2); the receiving wafers (3) are located on central axes between the launching wafers (1) and are separated from an electrical signal by the resin filling materials (2);and the backings (4) are arranged on one sides of the resin filling materials (2), and the other sides of the resin filling materials (2), the launching wafers (1) and the receiving wafers (3) are located on a same plane and covered with the acoustic lenses (5). The higher harmonic receiving and dispatching split type ultrasonic wave probe can realize receiving and dispatching split type ultrasonic detection, can realize high strength launching and broadband receiving, and enough signal-to-noise ratio can be guaranteed.
Description
technical field [0001] The invention belongs to the technical field of ultrasonic detection, and in particular relates to an ultrasonic probe and a separate sending and receiving measuring method for high-order harmonics. Background technique [0002] An ultrasonic probe is a device that converts other forms of energy into sound energy. In the production of traditional ultrasonic probes, PZT piezoelectric ceramic materials are usually used as the transmitting chip. Although its transmitting performance is good and the signal strength is high, the frequency band is narrow, and it cannot be used as a receiving chip to smoothly collect high-order harmonic signals. However, if the PVDF piezoelectric film is used for self-sensing and self-receiving measurement, although the PVDF piezoelectric film has a very wide frequency band, its signal is weak, the transmission efficiency is low, and the acquisition signal strength is weak. Therefore, it is difficult to find a piezoelectric ...
Claims
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Inventor陈凝曹永刚王月兵
OwnerCHINA JILIANG UNIV