Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of LED package and manufacturing method thereof

A technology for LED packages and manufacturing methods, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problems of durability affecting the connection stability of LED packages, so that it is not easy to heat up too fast and too high, reduce the impact, Effect of improving connection stability

Active Publication Date: 2020-08-07
ZHONGSHAN MULINSEN ELECTRONICS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the durability of the adhesive 800 is greatly affected by factors such as environmental conditions, moisture, and thermal oxidation. The durability of the adhesive 800 will directly affect the overall connection stability of the LED package.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of LED package and manufacturing method thereof
  • A kind of LED package and manufacturing method thereof
  • A kind of LED package and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0031] figure 2 shows the cross-sectional structure of the LED package in this embodiment, image 3 The disassembled structure of the heat sink 2 and the base 1 of the LED package in this embodiment is shown. The LED package includes a base 1, a heat sink 2 and a chip 3, the base 1 is provided with a mounting groove 11, the heat sink 2 is installed in the mounting groove 11, the chip 3 is connected and fixed on the heat sink 2 through an adhesive 4, the base Both the seat 1 and the heat sink 2 are made of materials with good thermal conductivity and heat dissipation. The base 1 is provided with a containing groove, and the containing pipe 5 is arranged in the containing groove, and the opening at one end of the containing pipe 5 communicates with the mounting groove 11 . The housing tube 5 is provided with an elastic limiter 6, and the elastic limiter 6 p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a LED packaging piece and a manufacturing method thereof. According to the key points of the technical scheme, an installation slot is formed in a base, the base is internallyprovided with an accommodation pipe, and an elastic limit piece is arranged in the accommodating pipe. A limit hole is formed in heat sink, the heat sink is installed in the installation slot and thebottom surface of the heat sink abuts and attaches with the bottom of the installation slot, and the elastic limit piece is inserted into the limit hole to realize the limit fixing of the heat sink. Due to the limit effect of the elastic limit piece, the heat sink can not be separated from the base, and the connection and fixation between the elastic limit piece and the base are realized. The elastic limit piece is located in the interior, and the internal environment, the external environment and the temperature are not affect the limit effect of the elastic limit piece. The external force and the internal force are difficult to destroy the limit effect of the elastic limit piece, so the durability of the elastic limit piece is better, the elastic limit piece can maintain the limit of theheat sink for a long time, the connection stability between the heat sink and the base is improved, and then the whole connection stability of the LED packaging piece is improved.

Description

technical field [0001] The present invention relates to the field of LED technology, more specifically, it relates to an LED package and a manufacturing method thereof. Background technique [0002] LED is the abbreviation of Light-Emitting Diode Light, which is light-emitting diode. Such as figure 1 As shown, the LED package generally includes a base 100, a heat sink 200 (ie, a heat sink), a chip 300, a phosphor layer 400, a filler 500, a lens 600, and a lead 700, and between the heat sink 200 and the base 100 and Both the chip 300 and the heat sink 200 are pasted and fixed by an adhesive 800 or solder. However, the durability of the adhesive 800 is greatly affected by factors such as environmental conditions, moisture, and thermal oxidation. The durability of the adhesive 800 will directly affect the overall connection stability of the LED package. Contents of the invention [0003] The invention aims to solve the technical problem that the durability of the adhesive ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64
Inventor 李钊英卢菊香董闽芳林秋凤梁俊杰李婷婷涂梅仙张沛
Owner ZHONGSHAN MULINSEN ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com