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LED package device and manufacturing method thereof

A technology of LED packaging and mounting surface, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of shortening the service life of LED packaging structures, affecting the reliability of UV LEDs, and destroying the sealing performance of sealants, achieving excellent gas barrier, Good sealing, good protective effect

Inactive Publication Date: 2019-05-21
ZHONGSHAN MULINSEN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, in the prior art, silica gel is usually used as the sealant. The silicone cup is prone to yellowing, aging and embrittlement after long-term exposure to ultraviolet light, which destroys the sealing performance of the sealant, seriously affects the reliability of the UV LED, and shortens the life of the LED. Service life of package structure

Method used

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  • LED package device and manufacturing method thereof
  • LED package device and manufacturing method thereof

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Embodiment Construction

[0025] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0026] Such as figure 1 and figure 2 As shown, the LED packaging device includes a substrate 1, a heat sink 2, a chip 3 and a light-transmitting plate 4, the heat sink 2 is mounted and fixed on the substrate 1, the chip 3 is mounted and fixed on the heat sink 2, and the light-transmitting plate 4 is covered on the on the substrate 1 and cover the chip 3 . The light-transmitting plate 4 is circular, and the lower surface of the light-transmitting plate 4 is provided with protrusions 41 around the circumference. The substrate 1 is also circular, and the upper surface of the substrate 1 is provided with grooves 11 around the circumference. Groove 11 is formed by inner spacer ring 12 and outer spacer ring 13, and outer spacer ring 13 is positioned at the outside of interior spacer ring 12, and the inner diameter and outer diameter of inner spacer ring 12 are ...

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Abstract

The invention discloses an LED package device and a manufacturing method. A PET film is arranged on an installation surface, used for pasting a substrate, of a transmitting plate, sealing glue is arranged between a lower surface of the PET film and the substrate, the transmitting plate is fixed with the substrate by the sealing glue, the gas and moisture permeability of the PET film is low, and the PET film has favorable air, water, oil and odor prevention performance, is high in transparency and good in glossiness and can be used for preventing ultraviolet ray. A relatively good protection effect on the sealing glue between the transmitting plate and the substrate can be achieved by the PET film, so that the sealing performance between the transmitting plate and the substrate is good, thereliability is high, and the service lifetime of the whole LED package device is relatively longer.

Description

technical field [0001] The present invention relates to the field of LED technology, more specifically, it relates to an LED packaging device and a manufacturing method thereof. Background technique [0002] As a new generation of green light source, LED has the advantages of high luminous efficiency, long life, energy saving and environmental protection, and has been widely used in many fields. In order to protect the LED chip as a light source, it usually needs to be packaged. The LED packaging device in the prior art is as follows: the LED chip is fixed on the substrate, the light-transmitting plate covers the LED chip, and then the light-transmitting plate and the substrate are sealed and bonded with a sealant. When the LED chip of the existing LED packaging device emits light, part of the light is refracted to the outside through the light-transmitting plate, and part of the light is reflected multiple times in the light-transmitting plate, and finally part of the ligh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/54H01L33/64
Inventor 李婷婷李颖李钊英卢菊香董闽芳梁俊杰林秋凤涂梅仙
Owner ZHONGSHAN MULINSEN ELECTRONICS CO LTD