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A high-efficiency electronic label packaging process and equipment

A technology of electronic label and packaging technology, which is applied in the direction of circuits, electrical components, transportation and packaging, etc., and can solve problems such as constraints, improvement of production efficiency of electronic labels, and inability to increase the speed of adhesion infinitely

Active Publication Date: 2020-10-09
GUANGZHOU MINGSEN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above-mentioned packaging process, the dispensing module and the die-bonding module adopt a sequential working mode, that is, in the dispensing station, the dispensing module needs to dispens glue to the antenna coil in the station in sequence until all Dispensing of antenna coils is completed; in the adhesion station, the chip bonding module needs to sequentially transport the chips to the conductive glue of different antenna coils until the chips are adhered to the antenna coils; in this way, the production speed of a single chip is limited by the point The single operation speed of the glue module and the single operation speed of the adhesive module, but the speed of dispensing glue and the speed of chip adhesion cannot be infinitely improved, which restricts the improvement of the production efficiency of electronic labels

Method used

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  • A high-efficiency electronic label packaging process and equipment
  • A high-efficiency electronic label packaging process and equipment
  • A high-efficiency electronic label packaging process and equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] See figure 1 with image 3 , The high-efficiency electronic label packaging equipment in this embodiment includes a discharging module 14 for discharging the roll-type substrate 11, a conveying module for conveying the substrate 11, and a conductive adhesive for arranging the substrate 11 The cloth glue module of the antenna coil on the material 11, the adhesive module for adhering the chip to the antenna coil, the hot-pressing module for hot-pressing the chip, and the hot-pressing module for collecting the hot-pressed electronic tags Collection module 15; wherein, the adhesion module includes a transfer seat for placing the transfer chip 1, a chip transfer module for transferring the chip to the transfer seat 1, and a transfer seat for driving the transfer seat 1 in the loading station and the adhesive Attached with a relay drive module that moves back and forth between stations and an adhesion drive module used to drive the relay seat 1 close to or away from the antenna...

Embodiment 2

[0085] The difference from Embodiment 1 is that the glue cloth module in this embodiment adopts screen printing to distribute glue, including a screen with glue outlets. The position layout of the glue outlets on the screen is consistent with that in the unit working area. The position layout of the substrate is the same. The conductive glue is placed on the screen during printing, and the screen is close to the unit working area of ​​the substrate, and the conductive glue on the screen is squeezed to transfer it to the substrate through the glue outlet.

Embodiment 3

[0087] See Figure 4-5 Unlike Embodiment 1, the relay drive module in this embodiment includes a relay pallet 5 for placing the relay seat 1 and a relay linear drive mechanism for driving the relay pallet 5 for linear movement; wherein, the The driving direction of the relay linear driving mechanism is perpendicular to the transmission direction of the antenna coil. The number of the transfer seat 1 is two, and they are evenly arranged along a straight line of the transfer support plate 5. In this embodiment, there are two loading stations, located on both sides of the adhesion station. Along the driving direction of the transfer linear drive mechanism, the two transfer seats 1 correspond to the two loading stations respectively. When one of the transfer seats When 1 is located in its corresponding loading station, the other transfer seat 1 is located in the adhesion station.

[0088] The intermediate linear drive mechanism includes a linear drive motor and a linear drive assemb...

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Abstract

The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be glued to a gluing working station; gluing the points on the antenna coils in the unit working areacorresponding to chip pins by a gluing module; conveying the unit working area to an adhesion station; transferring chips to a transfer seat by a chip transfer module, wherein the number and the position layout of the chips on the transfer seat exactly correspond to the number and the position layout of the antenna coils in the unit work area; driving the transfer seat to get close to the unit work area by an adhesion driving module, so that the chips are simultaneously and correspondingly attached to the antenna coils; hot-pressing the chips by a hot-pressing module; and collecting the chips.The device comprises a transfer seat, a gluing module, an adhesive module and a hot-pressing module. The process can achieve a plurality of gluing, adhesion and hot-pressing operations at one time, thereby improving the efficiency of the packaging.

Description

Technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing process and equipment, in particular to an efficient electronic label packaging process and equipment. Background technique [0002] Electronic tag, also known as radio frequency tag, is a data carrier that stores specific information, which can play the role of identification, item tracking, and information collection. Electronic tags are divided into passive electronic tags that passively send out signals and active electronic tags that actively send out signals. Both passive electronic tags and active electronic tags include two parts, an antenna and a chip electrically connected to the antenna. [0003] At present, electronic tags generally use flip-chip packaging technology, specifically: when the chip is packaged, conductive glue is first applied to the position corresponding to the antenna coil, and then the chip is adhered to the conductive glue, and then the chip is heated by a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L23/12H01Q1/50H01Q7/00G06K19/077
Inventor 王开来吴伟文赖汉进顾金如彭华明
Owner GUANGZHOU MINGSEN TECH CO LTD