A radio frequency payment module and a manufacturing method thereof

Abstract

The invention discloses a radio frequency payment module, relating to the technical field of smart cards, the radio frequency payment module comprises a circuit board, a double-sided conductive tape and a chip module; a combination mode of the conductive adhesive tape and the PCB is adopted; the problems that special-shaped molds are diversified and cannot be produced on a large scale can be effectively solved; particular, the PCB and the chip module are combined and assembled through a double-sided conductive adhesive tape. the plurality of chip modules are distributed on the carrier tape; forming carrier tape module, meanwhile, a conductive adhesive tape matched with the carrier tape module in length and width is adopted; a plastic package position, corresponding to the chip module, on the conductive adhesive tape is hollowed out; the carrier tape module and the conductive adhesive tape are hot-pressed and fixed through hot-pressing equipment; the method comprises the steps that a carrier tape module stamping die is used for stamping a carrier tape to form gum modules, the formed gum modules separate rubber through equipment subsequently, the chip modules on the carrier tape areseparated into single gum modules through the carrier tape module stamping die, finally, the multiple formed single gum modules are connected with a circuit board, and the payment module is formed.

Description

technical field [0001] The invention relates to the technical field of smart cards, in particular to a radio frequency payment module and a manufacturing method thereof. Background technique [0002] As the application of cards becomes more and more extensive, the market demand has also changed from the original ordinary smart cards to multi-form special-shaped cards. For example, the pattern has special-shaped cards such as twelve zodiac signs, Chinese knots, and poems. Most of these special-shaped cards use wire + lamination and PCB board welding. In terms of design, they can only be suitable for some simple plane special-shaped structures, such as Line + lamination method, if special-shaped cards need to be produced, the production cost will increase, and special-shaped cards of different shapes need to use different stamping dies. The PCB board welding method cannot be mass-produced and the height of the solder joints changes with personnel changes. The structural requi...

AI Technical Summary

Problems solved by technology

The PCB board welding method cannot be mass-produced and the height of the solder joints changes with personnel changes. The structural requirements are relatively strict and special-shaped products are not suitable for control, which leads to the inability to promote large-scale special-shaped cards.

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