Manufacturing method of flexible display device and flexible display device
A flexible display and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of PM-OLED failure and scrap, encapsulation plastic frame widening, breaking and other problems, to improve the production yield, Spread evenly
Active Publication Date: 2021-02-26
TRULY SEMICON
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Problems solved by technology
[0002] In the process of making flexible PM-OLED (Passive-Matrix Organic Light-Emitting Diode, passive organic electroluminescent diode), since it is necessary to apply encapsulation glue (such as UV glue) and desiccant before encapsulation and lamination, and encapsulation Both the encapsulant and the desiccant will expand during the lamination process, and inert gas needs to be injected into the encapsulation chamber during the lamination process to make the flexible back cover and the substrate more tightly bonded, resulting in the encapsulation frame at the lamination edge It needs to withstand a certain degree of pressure change inside and outside the packaging chamber, and the pressure change will cause the packaging plastic frame to widen and be broken by the gas (air shock), which will cause the PM-OLED to fail and be scrapped in the final packaging stage
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[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0049] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the a...
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Abstract
Embodiments of the present invention provide a method for manufacturing a flexible display device and the flexible display device, which relate to the field of display device manufacturing. Among them, by improving the coating pattern of the encapsulant, the present invention ensures that the encapsulant spreads evenly after the flexible back cover is attached to the array of flexible display devices to be packaged, and an independent and airtight seal can be formed between adjacent flexible display devices. The small space can effectively prevent the occurrence of the air shock phenomenon, and improve the production yield of the flexible display device.
Description
technical field [0001] The invention relates to the field of display device manufacturing, in particular to a method for manufacturing a flexible display device and the flexible display device. Background technique [0002] In the process of making flexible PM-OLED (Passive-Matrix Organic Light-Emitting Diode, passive organic electroluminescent diode), since it is necessary to apply encapsulation glue (such as UV glue) and desiccant before encapsulation and lamination, and encapsulation Both the encapsulant and the desiccant will expand during the lamination process, and inert gas needs to be injected into the encapsulation chamber during the lamination process to make the flexible back cover and the substrate more tightly bonded, resulting in the encapsulation frame at the lamination edge It is necessary to withstand a certain degree of pressure change inside and outside the packaging chamber, and the pressure change will cause the packaging plastic frame to widen and be br...
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IPC IPC(8): H01L51/56H01L51/52
Inventor 李源赵云刘然黄伟标罗志猛
Owner TRULY SEMICON